List of Thermal Conductivity Values for Natural and Engineered Materials

MSE Supplies is a leading supplier of high quality materials, equipment and materials characterization services for advanced materials research and manufacturing.

Shop our Single Crystals, Wafers and Substrates which are used for many applications. The following is a list of the most popular applications of our products including LED, ferroelectrics, piezoelectric, electro-optical, photonics, high power electronics, and high frequency power devices.  Contact us today for information on our custom solutions.

 Shop Single Crystals, Wafers & Substrates Shop Single Crystals, Wafers and Substrates>

Our product selection also includes Gallium Nitride (GaN) Substrates and Wafers.  Shop our Silicon Carbide (SiC) wafers, available in sizes up to 6" diameters including both N-Type and Semi-Insulating Types.

 Shop Silicon Carbide SiC Wafers

Shop Silicon Carbide SiC Wafers>

Shop Gallium Nitride GaN Template on Sapphire

Shop Gallium Nitride GaN Template on Sapphire>

MSE Supplies also provides the most comprehensive selection of sputtering targets both standard and custom-made on the market. Please contact us today to request a quote.


MSE Supplies stands behind our promise for high quality products with competitive pricing and dependable technical support from PhD Scientists. 

MSE Supplies, a U.S.-based supplier, is trusted by 5,000+ customers worldwide.

Materials Thermal Conductivity*


ABS (Acrylonitrile butadiene styrene) thermoplastic 0.25
Acrylic 0.2
Alumina (aluminium oxide, Al2O3)                 (Sputtering Target)(powders)(Milling media)   (Sapphire/Single Crystal)(Planetary Milling Jars)(Roller Milling Jars)(High Purity Powders) 12
Aluminum (Sputtering Target) 205
Aluminum Alloy AlSi7Mg (Additive Manufacturing/3D Printing Powder) 160 - 170
Aluminum Alloy AlSi10Mg (Additive Manufacturing/3D Printing Powder) 119
Aluminum Alloy AlSi12 (Additive Manufacturing/3D Printing Powder) 121
Aluminum Metaphosphate, Al(PO3)3 (High Purity Powder)
Aluminum nitride (Sputtering Target)(AlN template on Sapphire 285
Antimony (Sputtering Target) 24
Arsenic 50
Bakelite, bleached 0.2
Barium 18
Barium Fluoride, BaF2 (High Purity Powder)(Single crystal and Substrates)(Sputtering Targets) 12.1
Barium ferrite,
Barium Titanate, BaTiO3 (Sputtering Target) (Single Crystal Substrate) 6
Benzocyclobutene 0.3


Bismuth (Sputtering Target) 10
Bismuth Germanate, Bi4Ge3O12                    (Scintillation Crystals) 3.29
Bismuth Oxide, Bi2O3 (High Purity Powder)(Sputtering Target) 1.3 - 2.2
Boron Carbide,B4C (Sputtering Target) 17 - 42
Boron Nitride, BN (Sputtering Target) 751
Brass 109
Brick masonry 0.4 - 0.7
Bronze 26
Cadmium (Sputtering Target) 92
Cadmium Difluoride, CdF2 (Sputtering Target)
Cadmium Selenide, CdSe (Sputtering Target) 0.04
Cadmium Sulfide, CdS (Sputtering Target) 40.1
Cadmium Telluride, CdTe (Sputtering Target) 0.083
Calcium 200
Calcium Fluoride, CaF2 (Single Crystal)(Sputtering Target)(Eu doped Scintillation Crystal) 9.71 
Calcium Fluoride Europium doped, Eu:CaF2   (Eu doped Scintillation Crystal) 9.7
Cast Iron Gray 52
Cellulose acetate (CA) 0.17 - 0.34
Cellulose acetate butynate (CAB) 0.16 - 0.32
Cellulose nitrate (CN) 0.12 - 0.21
Cement 1.73
Cesium Iodide, CsI (Scintillation Crystals) 1.1
Cerium (Sputtering Target) 11
Cerium Dioxide,  CeO2 (Sputtering Target) 14.2
Cerium Fluoride, CeF3 (Scintillation Crystal) (Sputtering Target) 1.57
Cerium Oxide, Ce2O3 (High Purity Powder) 12
Chlorinated polyether 0.13
Chlorinated polyvinylchloride (CPVC) 0.136
Chromium (Sputtering Target) 93.9
Chromium Boride, Cr5B3 (Sputtering Target)
Chromium Carbide, Cr3C2 (Sputtering Target) 189.77
Chromium Diboride CrB2 (Sputtering Target) 20.48 - 31.77
Chromium Dioxide, CrO2  236.2
Chromium Diselenide, CrSe2  35.3
Chromium Disilicide, CrSi2 (Sputtering Target) 10
Chromium Disulfide, CrS2  88.8
Chromium Ditelluride, CrTe2  27.9
Chromium Monoboride, CrB 20.1
Chromium Nitride, CrN 3.5
Chromium Nitride, Cr2N  12
Chromium Oxide, Cr2O3 (High Purity Powder)(Sputtering Target) 5.17
Clay tile structure 0.6 - 2.5
Cobalt (Sputtering Target) 100
Cobalt Chrome Molybdenum alloy, CoCrMo (Additive Manufacturing/3D Printing Powder) 13
Cobalt Chrome Tungsten alloy, CoCrW (Additive Manufacturing/3D Printing Powder) 9.4
Cobalt Disilicide, CoSi2 
Concrete 0.1 - 0.3
Concrete structure 1.0 - 1.8
Constantan 23.3
Copper (Sputtering Target) 385
Copper, Beryllium 25 105 - 130
Copper Tin alloy, CuSn10 (Additive Manufacturing/3D Printing Powder) 59
Cupronickel 30% 30
Diamond (Carbon) 2200
Duralumin 225
Dysprosium (Sputtering Target) 11
Dysprosium Oxide, Dy2O3 (High Purity Powder)(Sputtering Targets) 29.5
Ebonite 0.17
Epoxy, cast resins & compounds, unfilled 0.35
Erbium (Sputtering Target) 15
Erbium Oxide, Er2O3 (High Purity Powder)(Sputtering Targets) 6.5
Ethylene ethyl acrylate (EEA) 0.42
Ethylene vinyl acetate (EVA) 0.21
Europium (Sputtering Target) 14
Europium Oxide, Eu2O3 (High Purity Powder) 14

Fluorspar, CaF2 (Single Crystal)    (Sputtering Target)

Gadolinium (Sputtering Target) 10.5
Gadolinium Gallium Garnet (GGG), Gd3Ga5O12 (Single Crystal)(Nd doped Single Crystal) 7.4
Gadolinium Oxide, Gd2O3 (High Purity Powder) 6.2
Gadolinium Tetraboride, GdB4  148.5
Gallium 40.6
Gallium Arsenide, GaAs (Sputtering Target)  (Single Crystal Substrates 0.55
Gallium Oxide, Ga2O3 (Single Crystal Wafer)(High Purity Powder)(Sputtering Target) 17  
Gallium Nitride, GaN (Single Crystal) 253
Germanium (Sputtering Target)(Single Crystal) 0.58
Germanium Oxide, GeO2 (High Purity Powder) 60.2
Germanium Telluride, GeTe (Sputtering Target) 8.6
Glass, Pyrex 1.0
Gold (Sputtering Target) 310
Granite 3.1
Graphite, pure (Carbon) (Sputtering Target)  (Anode Materials) 168
Hafnium (Sputtering Target) 22
Hafnium Carbide, HfC (Sputtering Target) 4.18
Hafnium Dioxide,  HfO2 (Sputtering Target) 1.1
Hafnium Disilicide, HfSi2 (Sputtering Target) 104
Hafnium Nitride, HfN (Sputtering Target) 22
Hard alloy K20 83
Hastelloy C22 (Sputtering Target) 10.1
Hastelloy C276 (Sputtering Target) 10.2
Hastelloy N (Sputtering Target) 11.5
Holmium (Sputtering Target) 16
Holmium Oxide, Ho2O3 (High Purity Powder)(Sputtering Targets)
Ice, 0oC water 2.18
Inconel 625                                                    (Additive Manufacturing/3D Printing Powder) 9.8
Inconel 718                                                    (Additive Manufacturing/3D Printing Powder) 11.4
Indium (Sputtering Target) 81.8
Indium Antimonide, InSb (Sputtering Target) 18

Indium Arsinide, InAs (Single Crystal)(Sputtering Target)

Indium Gallium Zinc Oxide (IGZO), In2Ga2ZnO7 (Sputtering Target) 1.4
Indium Oxide, In2O3 (High Purity Powder)(Sputtering Target)
Indium Phosphide, InP (Single Crystal) 68
Indium Sulfide, In2S3 (Sputtering Target)


Indium Tin Oxide (ITO),  In2-xSnxO3 (Sputtering Target)(ITO coated glass and film) 10
Iridium (Sputtering Target) 147
Iron, pure (Sputtering Target) 80
Iron, cast 52
Iron Boride, FeB (Sputtering Target)
(Di)Iron Boride Fe2B (Sputtering Target)
(Tri)Iron Carbide, Fe3C (Sputtering Target)
Langasite (LGSO), La3Ga5SiO14 (Single Crystal)
Langatate (LGT), La3Gao5.5Ta0.5O14 (Single Crystal)
Lanthanum (Sputtering Target) 13.4
Lanthanum Aluminate, LaAlO3 (Single Crystal)(Sputtering Target) 10 @ 100°C
Lanthanum Fluoride, LaF3 (Sputtering Target) 5.1
Lanthanum Hexaboride, LaB6 (Sputtering Target) 43.5
Lanthanum Manganate, LaMnO3          (Sputtering Target) 1.29
Lanthanum Oxide, La2O3 (High Purity Powder) 6
Lanthanum-Strontium Aluminium Tantalate (LSAT), (La0.18Sr0.82)(Al0.59Ta0.41)O3 (Single Crystal) 5.1
Lead (Sputtering Target) 34.7
Lead Fluoride, PbF2 (Single Crystal)(Sputtering Target) 1.4
Lead Selenide, PbSe (Sputtering Target) 1.62
Lead Sulfide, PbS (Sputtering Target) 2.5
Lead Telluride, PbTe (Sputtering Target) 2
Lead Tungstate, PbWO4 (Single Crystal) 2.2
Limestone 1.3
Lithium (Chips for Batteries) 85
Lithium Aluminate,  LiALO2 (Single Crystal) 9.14
Lithium Fluoride, LiF (Sputtering Target)(High Purity Powder)(Single Crystal) 11.3
Lithium Niobate,  LiNbO3 (Single Crystal)      (Sputtering Target) 5.6
Lithium Tantalate,  LiTaO3 (Single Crystal) 46
Lutetium (Sputtering Target) 16.2
Lutetium Aluminum Garnet (LuAG),Y3Al5O12  8.3
Lutetium Oxide, Lu2O3 (High Purity Powder) 12.5
Macor 1.6
Magnalium 125
Magnesium (Sputtering Target) 156
Magnesium Aluminate, MgAl2O4 (Single Crystal) 19
Magnesium Fluoride,MgF2 (Sputtering Target)(Single Crystal)(High Purity Powder)  (Single Crystal Substrates) 11.6

Magnesium Oxide, MgO (Sputtering Target)(Crucible)(Single Crystal Substrate)(High Purity Powder)

Manganese (Sputtering Target) 7.81
Marble 2.08 - 2.94
Mercury 8.3
Mica 0.71
Molybdenum (Sputtering Target) 138
Molybdenum Boride, Mo2B (Sputtering Target) 146
Molybdenum Carbide, Mo2C (Sputtering Target) 48.4
Molybdenum Dioxide, MoO2  209.6
Molybdenum Diselenide, MoSe2 46.2
Molybdenum Disilicide, MoSi2 (Sputtering Target) 65
Molybdenum Disulfide, MoS2  82.2
Molybdenum Ditelluride, MoTe2  41.1
Molybdenum Trioxide, MoO3 (Sputtering Target) 6
Monel metal 26
Neodymium (Sputtering Target) 17
Neodymium Copper Oxide, Nd2CuO4 (Sputtering Target)
Neodymium Fluoride,  NdF3 (Sputtering Target)
Neodymium Hexaboride,  NdB6 (Sputtering Target) 47.3
Neodymium Oxide, Nd2O3 (High Purity Powder)
Nickel (Sputtering Target) 60.7
Nickel Chromium (Nichrome), NiCr                 (Sputtering Target) 11.3
Nickel Oxide, NiO (Sputtering Target) 50
Niobium (Sputtering Target) 54
Niobium Carbide, NbC (Sputtering Target) 15
Niobium Disilicide, NbSi 41.8
Niobium Nitride, NbN (Sputtering Target) 4.2
Niobium Oxide, Nb2O5 (Sputtering Target)    (High Purity Powder) 1
Niobium Selenide, NbSe(Sputtering Target) 90 @20K
Niobium Silicide, Nb5Si3 (Sputtering Target)
Nylon, general purpose 0.25
Nylon, Type 11, molding and extruding compound 0.30
Nylon, Type 12, molding and extruding compound 0.06
Nylon, Type 6, cast (Planetary Milling Jar)(Roller Milling Jar) 0.25
Nylon, Type 6/6, molding compound 0.7
Osmium 87.6
Palladium (Sputtering Target) 71.2
Paraffin 0.25
Platinum (Sputtering Target) 71.6
Plutonium 0.065
Polybutylene (PB) 0.27
Polycarbonate (PC) 0.2
Polyester 0.05
Polyethylene terephthalate (PET) (Indium Tin Oxide on PET)(Monolayer Graphene on PET) 0.28
Polypropylene (PP), unfilled (Single Crystal, Wafer Substrate Cases) 0.11
Polystyrene (PS) 0.03
Polysulfone (PSO) 0.26
Polyurethane (PUR), rigid (Planetary and Roller Milling Jars) 0.02
Polyvinyl chloride (PVC) 0.14
Porcelain, Industrial 1.05
Potassium 100
Potassium Bromide, KBr (Single Crystal) 4.81
Potassium Chloride, KCl (Single Crystal) 6.63
Potassium Tantalate, KTaO3 (Single Crystal) 19
Praseodymium (Sputtering Target) 13
Praseodymium Fluoride, PrF3 (Sputtering Target)
Praseodymium Oxide, Pr6O11 (High Purity Powder)(Sputtering Targets)
Promethium 17.9
Quartz (Single Crystal Wafer)(Monolayer Graphene on Quartz) Parallel to a-6.2, c-10.7
Rhenium (Sputtering Target) 48
Rhenium Disilicide, ReSi2 
Rhodium 151
Ruthenium (Sputtering Target) 117
Samarium (Sputtering Target) 13
Samarium Oxide, Sm2O3 (High Purity Powder)(Sputtering Targets) 1.9
Sapphire (Single Crystal and Wafers) 43.93
Scandium (Sputtering Target) 12.55
Scandium Oxide, Sc2O3   (High Purity Powder)(Sputtering Targets) 16.5
Selenium (Sputtering Target) 0.75
Silicon (Single Crystal Wafer)(Sputtering Target)(N-type Sputtering Target)(P-type Sputtering Target) 125.5
Silicon Carbide, SiC (Single Crystal Wafer)   (Sputtering Target) 360-490 @300K depending on polytype
Silicon Dioxide (Fused Silica, amorphous),  

SiO2 (Sputtering Target)(Wafers and Substrates)(High Purity Powder)

Silicon Nitride,Si3N4 (Sputtering Target) 26
Silver (Sputtering Target) 429
Sodium 133.89
Sodium Chloride, NaCl (Single Crystal) 8.16
Sodium Fluoride, NaF (Sputtering Target) 10.5
Solder lead - tin, 50% - 50% 50
Steel 18 Ni(300) (Maraging) (Additive Manufacturing/3D Printing Powder) 25.3
Steel Invar 36 (Additive Manufacturing/3D Printing Powder) 10.15
Steel M2 (Tool)(Additive Manufacturing/3D Printing Powder) 19
Steel Stainless Austenitic (304) (Milling media)(Planetary Milling Jars)(Roller Milling Jars) 16.2
Steel Stainless Austenitic (310) 14.2
Steel Stainless Austenitic (316)(Additive Manufacturing/3D Printing Powder)(Milling media)(Roller Milling Jars)(Planetary Milling Jars) 15
Steel Stainless Ferritic (410)(Additive Manufacturing/3D Printing Powder) 24.9
Steel Stainless 17-4PH (Additive Manufacturing/3D Printing Powder) 17.9
Steel Stainless 440C (Additive Manufacturing/3D Printing Powder) 24.2
Strontium 35
Strontium Fluoride, SrF2 (Sputtering Target) 9.9
Strontium Titanate, SrTiO3 (Sputtering Target)(Single Crystal Wafers & Substrates) (Fe doped single Crystal)(Nb doped single Crystal) 10.1
Tantalum (Sputtering Target) 57.5
Tantalum Carbide, TaC (Sputtering Target) 21
Tantalum Diboride, TaB2  16
Tantalum Disilicide, TaSi2 (Sputtering Target)
Tantalum Nitride, TaN (Sputtering Target) 5.5
Tantalum Pentoxide, Ta2O(Sputtering Target)(High Purity Powder)
Tantalum Sulfide, TaS2 (Sputtering Target) 140
Teflon, (Sputtering Target)(Planetary Milling Jars)(Roller Milling Jars) .25
Tellurium (Sputtering Target) 3
Tellurium Dioxide,TeO2 (Single Crystal) 3
Terbium (Sputtering Target) 11
Thallium 46
Thorium 54
Thulium (Sputtering Target) 16.9
Thulium Oxide, Tm2O3 (High Purity Powder)(Sputtering Targets) 4.4
Tin (Sputtering Target) 66.6
Tin Oxide SnO2 (Sputtering Targets) 17.5
Titanium (Sputtering Target) 17
Titanium Alloy Ti-6Al-4v (TC4)(Additive Manufacturing/3D Printing Powder) 6.7
Titanium Carbide, TiC (Sputtering Target) 22
Titanium Diboride, TiB2 (Sputtering Targets) 66.4
Titanium Dioxide (Rutile), TiO2 (Single Crystal)(High Purity Powder)(Sputtering Target) 4.8
Titanium Disilicide, TiSi2 (Sputtering Target) 38
Titanium Monoxide, TiO (Sputtering Target)
Titanium Nitride, TiN (Sputtering Target) 19
Titanium (III) Oxide, Ti2O3 (High Purity Powder) 0.02
Titanium Silicide, Ti5Si3 
Topas 0.15
Tungsten (Sputtering Target) 173
Tungsten Carbide (Cobalt Stabilized), WC-6%Co (Sputtering Target)(Milling Media)       (Planetary Milling Jars)(Pellet Pressing Die) 110
Tungsten Diboride, WB2  1.4
Tungsten Dioxide, WO2  157.5
Tungsten Diselenide, WSe2 (Sputtering Target) 72.7
Tungsten Disilicide, WSi2 (Sputtering Target) 40.6
Tungsten Disulfide, WS2 (Sputtering Target) 121.2
Tungsten Ditelluride, WTe2 (Sputtering Target) 30.2
Tungsten (VI) Oxide, WO3 (High purity Powder)(Sputtering Target) 25.1
Uranium 27
Vanadium (Sputtering Target) 35
Vanadium Carbide, VC (Sputtering Target) 36.4
Vanadium Disilicide, VSi2 (Sputtering Target)
Vanadium Nitride, VN 12.1
Vanadium Oxide, V2O5 (Sputtering Target) 3.84
Vinyl Ester 0.25

YCOB, Ca4YO(BO3)3 (NLO Crystal)

Parallel to a-1.83, b-1.72, c-2.17
Ytterbium (Sputtering Target) 38.5
Ytterbium Fluoride, YbF(Sputtering Target)
Ytterbium Oxide, Yb2O(High Purity Powder)(Sputtering Targets) 4.5
Yttrium (Sputtering Target) 17
Yttrium Aluminum Garnet (YAG),Y3Al5O12 (YAG Single Crystal)(Ce:YAG single Crystal)(Er:YAG Single Crystal)(Nd:YAG Single Crystal)(Yb:YAG Single Crystal)(Ce:YAG LED Phosphor) 10.8
Yttrium Fluoride, YF3 (Sputtering Target)
Yttrium Oxide, Y2O(High Purity Powder)(Sputtering Targets) 13.6
Yttrium Orthovanadate, YVO4 (Single Crystal)     (Nd doped Single Crystal) 14
Zinc (Sputtering Target) 112.2
Zinc Oxide, ZnO (Single Crystal)(Sputtering Target)(High Purity Powder) 50
Zinc Selenide, ZnSe (Sputtering Target) 14
Zinc Sulfide, ZnS (Sputtering Target) 25.1
Zinc Telluride, ZnTe (Sputtering Target) 10.8
Zirconium (Sputtering Target) 23
Zirconium Carbide, ZrC (Sputtering Target) 33.5
Zirconium Diboride, ZrB2 (Sputtering Target) 25.1
Zirconium Disilicide, ZrSi2 (Sputtering Target)
Zirconium Nitride, ZrN (Sputtering Target) 8.8
Zirconia, ZrO2 (High Purity Powder) 2
Yttria Stabilized Zirconia (YSZ), 3-8% Y2O3 /ZrO2  (Sputtering Target)(Single Crystal)(Milling Media)(Planetary Milling Jars)(High Purity Powder) 3% =2.2 , 8% =2.9

 *Unless otherwise noted values at 25°C.


      Shop All MSE Supplies Products