MSE Supplies offers Desktop Microwave Plasma Asher System. Microwave plasma cleaning and ashing (descumming) process is an advanced dry process using common industrial gases as raw materials, such as oxygen, nitrogen, argon, carbon tetrafluoride and many other gases. This process is rather environmentally friendly and efficient in cleaning; therefore, it has been promoted by more and more industry users. Our system can accommodate wafers up to 8 inch in diameter. It is suitable for wafer dry ashing or wafer surface activation and other batch processes. It is widely used in surface treatment related applications like automobiles, batteries, biomaterials, etc.

Applications:

Batch wafer surface activation
Batch wafer photoresist removal
Removal of MEMS sacrificial layers
DESCUM process

Technical Specifications

Dimension (W x D x H)	690mm x 630mm x 620mm
Weight	~150kg (without vacuum pump)
Chamber Material	Quartz chamber with drawer type aluminum chamber door
Chamber Dimension (φ x D)	250mm x 330mm
Chamber Volume	16L
Power	380~420VAC , 3 phase ; 50/60Hz
Microwave Source	2.45GHz microwave, 100~1200W continuous and adjustable
Process Gas Line	MFC control (standard: 2 channels), maximum support for 4 channels.
Dry Compressed Air	0.5~0.6MPa
Working Pressure	≤100Pa
Vacuum Gauge	Pirani with measuring range 1~1E5 Pa
Vacuum Valve	Electronic pneumatic valve
Vacuum Pump	Dry pump (standard) ; Oil pump (optional)

*Pleas contact us for detail specification and optional items.

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