Silicon-on-Insulator (SOI) wafer is a structure including the device layer (top), buried oxide layer (middle), and handle wafer (bottom). This technology allows for the continuous miniaturization of microelectronic devices. It has several advantages over a traditional silicon wafer, like low leakage currents and low parasitic capacitance. It is used in various applications, including MEMS, sensors, telecommunications, and power devices. For example, the researchers at Toyota Central R&D Labs proposed simple T-shaped support as a solution to the tilt deformation caused by the residual stress. This solution could potentially allow for the development of high-precision sensors and actuators.

Types of SOI Wafers:

SIMOX: Device Layer Thickness < 250nm

BESOI: Device Layer Thickness between 1 μm ~ 300μm

SIMBOND: Device Layer Thickness < 200nm

Smart-Cut: Device Layer Thickness < 1.5μm

Capability:

Parameter	Specification Range
Diameter	100 ~ 200mm
Device Layer
Thickness	0.1 ~ 300μm
Type	P or N (please specify if you need certain dopant)
Orientation	(100) or (111) or (110)
Box Layer
Thickness	up to 3.5μm
Uniformity	± 2.5%
Handle Wafer
Type	P or N (please specify if you need certain dopant)
Resistivity	Customized

*The figure is for reference only. The actual product may look different due to configuration difference.

References:

1. The Genesis Process/sup TM: a new SOI wafer fabrication method. In 1998 IEEE International SOI Conference Proceedings (Cat No. 98CH36199), pp. 163-164. IEEE, 1998.

2. Layout controlled one-step dry etch and release of MEMS using deep RIE on SOI wafer. Journal of microelectromechanical systems 15, no. 3 (2006): 541-547

3. Improved anchor design for flat MEMS structure by suppressing deformation due to buried-oxide stress on silicon-on-insulator wafer. Journal of Micromechanics and Microengineering 31, no. 4 (2021): 045001.