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MSE PRO 1" JGS3 Fused Silica Wafer, 500 μm Thick, DSP, w/ Bevel, Primary Flat Only - MSE Supplies LLC

MSE PRO 1" JGS3 Fused Silica Wafer, 500 μm Thick, DSP, w/ Bevel, Primary Flat Only

  • $ 3295
  • Save $ 387

MSE PRO™ 1" JGS3 Fused Silica Wafer, 500 μm Thick, DSP, w/ Bevel, Primary Flat Only

Order 1" (25.4 mm) fused quartz wafers with best price on the market from a trusted materials supplier, MSE Supplies. Fused silica is used for both transmissive and reflective optics, especially where high laser damage threshold is required. JGS3 is used for IR & UV substrate.

  • Custom made JGS3 fused silica wafers and substrates are available upon request. Please contact us for a quote.
  • Corning Fused Silica 7980 High Purity Fused Silica (HPFS) and JGS1 Fused Silica wafers, windows and substrates are also available and can be custom made. Please contact us for a quote.
  • Single Crystal Quartz Wafers and Substrates are also available. Please contact us for a quote.

Brand: MSE PRO™ 

Manufacturer: MSE Supplies LLC

Specifications:

 SKU# WA1009
Material SiO2, fused silica (fused quartz)
Grade JGS3 (optical grade fused silica)
Diameter 25.4 ± 0.2 mm
Thickness 500 ± 25 μm
Primary Flat 8 ± 2 mm
Surface Polishing Double Side Polished (DSP) with surface roughness Ra < 1 nm on both the top surface and bottom surface
Surface Finish S/D 40/20
TTV < 10 μm
Edge With Bevel, C shape CNC edge grounding

 

Physical Properties of Fused Silica

Density 2.2 g/cm3
Coefficient Of Thermal Expansion 5.5*10-7 /°C (20 °C - 320 °C)
Thermochromism Under constant temperature of 1140 degrees, keep annealing for 30 minutes without discoloration.

Applications:

Fused silica (SiO2) wafers are made from high purity fused silica, ground and polished to optical grade on both sides. The fused silica wafers are suitable for many optical applications because of their excellent optical transmission characteristics. Fused silica also has excellent chemical resistance against a wide variety of solvents, as well as exceptional heat resistance, with high dimensional stability over a wide temperature range thanks to its ultra low thermal expansion coefficient.