1" JGS2 Fused Silica Wafer, 500 um Thick, DSP, w/ Bevel, No Flat - MSE Supplies LLC

1" JGS2 Fused Silica Wafer, 500 um Thick, DSP, w/ Bevel, No Flat

  • $ 1795
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1" JGS2 Fused Silica Wafer, 500 um Thick, DSP, w/ Bevel, No Flat

Order 1" (25.4 mm) fused quartz wafers with best price on the market from a trusted materials supplier, MSE Supplies.

The JGS2 fused silica is equivalent to Homosil 1, 2 & 3 (Heraeus), Dynasil 1000 & 4000 and 5000 & 6000 (Dynasil)

  • Custom made JGS fused silica wafers and substrates are available upon request. Please contact us for a quote.
  • Corning Fused Silica 7980 High Purity Fused Silica (HPFS) and JGS1 Fused Silica wafers, windows and substrates are also available and can be custom made. Please contact us for a quote.

Product Number: WA1006

Material: SiO2, fused silica (fused quartz)

Grade: JGS2 (Optical Grade Fused Silica)

Diameter: 25.4 +/- 0.2 mm

Thickness: 500 +/- 25 um

No Flat

Surface Polishing: Double Side Polished (DSP) with surface roughness Ra < 1 nm on both the top surface and bottom surface

Surface Finish: S/D 40/20

TTV: < 10 um

Edge: with Bevel, C shape CNC edge grounding

Physical Properties of Fused Silica

  • Density: 2.2 g/cm3
  • Coefficient of Thermal Expansion: 5.8*10^-7 /k (298 ~ 573 deg K)
  • Thermochromism: Under constant temperature of 1140 degrees, keep annealing for 30 minutes without discoloration.

Fused silica (SiO2) wafers are made from high purity fused silica, ground and polished to optical grade on both sides. The fused silica wafers are suitable for many optical applications because of their excellent optical transmission characteristics. Fused silica also has excellent chemical resistance against a wide variety of solvents, as well as exceptional heat resistance, with high dimensional stability over a wide temperature range thanks to its ultra low thermal expansion coefficient.

Single Crystal Quartz Wafers and Substrates are also available.