SiC Epitaxial Wafers on SiC Substrates (6H-SiC or 4H-SiC), Silicon Carbide Epi Wafers (up to 6 inch size)

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Customized silicon carbide SiC epitaxial wafers are provided by MSE Supplies to meet your specific requirements.  Please discuss your project needs with our scientists and engineers. 

SiC epitaxial wafers have the advantages of operating under high-voltage, high electric current, and at high temperatures compared to semiconductor devices based on silicon. These unique features of SiC epitaxial wafers lead to the miniaturization of devices, enabling smaller and lighter power control modules to be made. 



4H-SiC Single Crystal

6H-SiC Single Crystal

Lattice Parameters (Å)





Stacking Sequence






Mohs Hardness



Thermal Expansion Coefficient (CTE) (/K)

4-5 ×10-6

4-5 ×10-6

Refraction Index @750nm

no = 2.61

ne = 2.66

no = 2.60

ne = 2.65

Dielectric Constant

c ~ 9.66

c ~ 9.66

Doping Type

N-type or Semi-insulating

N-type or Semi-insulating

Thermal Conductivity (W/cm·K @298K)

(N-type, 0.02 ohm·cm)




Thermal Conductivity (W/cm·K @298K)

(Semi-insulating type)







Band-gap (eV)



Break-Down Electrical Field (V/cm)



Saturation Drift Velocity (m/s)

2.0 x 105

2.0 x 105

Wafer and Substrate Sizes

Wafers: 2”, 3”, 4”, 6”; small substrates: 10x3, 10x5, 10x10, 15x15, 20x15, 20x20 mm, other sizes are available and can be custom-made upon request

Product Grades

A Grade – Zero micropipe density (MPD ≤ 1 cm-2)

B Grade – Production grade (MPD ≤ 5 cm-2)

C Grade – Research grade (MPD ≤ 15 cm-2)

D Grade – Dummy grade (MPD ≤ 50 cm-2)



MSE Supplies offers the best price on the market for high quality SiC epitaxial wafers up to six (6) inch diameter.  Our price matching policy guarantees you the best price for the SiC epi wafers with comparable specifications.  CONTACT US today to get your quote. 


Customized SiC crystal products can be made to meet customer's particular requirements and specifications. 


Applications of SiC Crystal Substrates and Wafers

Silicon carbide (SiC) crytsals have unique physical and electronic properties. Silicon Carbide based devices have been used for short wavelength optoelectronic, high temperature, radiation resistant applciations.  The high-power and high-frequency electronic devices made with SiC are superior to Si and GaAs based devices.  Below are some popular applications of SiC substrates.  

III-V Nitride Deposition

GaN, AlxGa1-xN and InyGa1-yN epitaxial layers on SiC substrate or sapphire substrate.

Gallium Nitride Epitaxy on SiC Templates are used to fabricate blue light emitting diodes (blue LED) and and nearly solar blind UV photodetectors

Optoelectronic Devices

SiC based devices have low lattice mismatch with III-nitride epitaxial layers.  They have high thermal conductivity and can be used for the monitoring of combustion processes and for all sorts of UV-detection.

SiC-based semiconductor devices can work under very hostile environments, such as high temperature, high power, and high radiation conditions.

High Power Devices

SiC has the following properties:

Wide Energy Bandgap

High electrical breakdown field

High saturation drift velocity

High thermal conductivity

SiC is used for the fabrication of very high-voltage and high-power devices such as diodes, power transitors, and high power microwave devices. Compared to conventional Si-devices, SiC-based power devices have faster switching speed higher voltages, lower parasitic resistances, smaller size, less cooling required due to high-temperature capability.

SiC has higher thermal conductivity than GaAs or Si meaning that SiC devices can theoretically operate at higher power densities than either GaAs or Si. Higher thermal conductivity combined with wide bandgap and high critical field give SiC semiconductors an advantage when high power is a key desirable device feature.

Currently silicon carbide (SiC) is widely used for high power MMIC

applications. SiC is also used as a substrate for epitaxial growth of GaN for even higher power MMIC devices

High Temperature Devices

Because SiC has a high thermal conductivity, SiC dissipates heat more rapidly than other semiconductor materials. This enables SiC devices to be operated at extremely high power levels and still dissipate the large amounts of excess heat generated from the devices.  

High Frequency Power Devices

SiC-based microwave electronics are used for wireless communications and radar.

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