MSE PRO Titanium Diboride Sputtering Targets TiB2
Specifications for Titanium Boride Sputtering Targets
To add a Cu Backing Plate with Indium Bonding for Sputtering Targets 
| Material Type | Titanium Diboride |
| Symbol | TiB2 |
| Melting Point (°C) | 2,900 |
| Theoretical Density (g/cc) | 4.5 |
| Z Ratio | **1.00 |
| Sputter | RF |
| Max Power Density (Watts/Square Inch) |
20* |
| Type of Bond | Indium, Elastomer |
| Purity | 99.5% |
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