Double-tank etch cell setup
This is a horizontally mounted, double-tank cell typically used for anodization of Si-wafers with electrolyte backside contact. It consists of two polyether ether ketone (PEEK) gas-tight chambers each equipped with sapphire wafer serving as window for illumination allowing light-assisted porous Si formation. It well fits aqueous (FKM/EPDM O-Rings) and organic solvent (FFKM O-Rings) electrolyte requirements. The Si substrate is mounted in between these chambers and sealed with O-rings under magnetic/screw mount. The preparation of a whole porous Si substrate with this cell is possible at one simple etching step, assuring high reproducibility.
Double-tank etch cell is typically used for fabrication of porous Si membranes via anodization. The process of porous Si formation is performed galvanostatically by applying current between two platinum electrodes. One or both sides of Si substrate can be illuminated during the process by an external lamp (typically halogen or LED, not included). If illumination is not necessary, blind covers can be mounted instead. The main process parameters are: current density and etching time. In this cell, there is no need to prepare additional metal contact on Si-water to secure electric contact. Other applications include electro-polishing of Si substrates, electrodeposition and electrochemical characterization.
nominal exposure area: 1 cm2
minimum electrolyte volume: 2x10 mL
maximum electrolyte volume: 2x15 mL
electrode plug diameter: 6 mm
recommended Si-wafer size: 25 mm x 25 mm
1 x Magnetic Mount Double-Tank Etch Cell – MM Double-Tank Cell 2x15mL (or Double-Tank Etch Cell – Double-Tank Cell 2x15mL)
2 x Metal Wire Auxiliary Electrode - 50HX15 0.6/250 mm
2 x Pseudo-Reference Electrode – PR 0.6/30mm