Lithium Battery Grade Copper Foil (180mm W x 9um T) for Battery Anode Substrate, 5kg/roll
This copper foil is widely used as a substrate (current collector) for anode materials coating in Li-Ion battery research.
Copper foil chosen guidance:
The thin thickness of copper foil can increase the power density of the entire battery. However, the thinner copper foils cost more due to its production complexity. Currently, 9 um is popular for batter R&D and industry.
The surface roughness is a key parameter for slurry coating quality. Too smooth surface may cause the film crack during drying while too rough surface is bad for slurry coating uniformity. Our copper foil can give a uniform slurry coating based on customer feedback.
The tension strength and elongation can effect the battery reliability and cycling performance. Copper foil with good tension strength and elongation can avoid the break and crack due to handling.
Note: The width and thickness of copper foil can be customized and the surface can be coated by carbon upon request. Please contact email@example.com
||5.0 kg per roll|
Fe < 0.0010%
Bi < 0.00020%
Pb < 0.0005%
|180mm W x 9um T or Customized|
|Areal density (g/m2)||85~90|
|Tensile strength (MPa)||≥294|
|High temperature Tensile strength 180℃ (MPa)||≥147|
|Normal elongation (%)||2.5|
|High temperature elongation 180℃ (%)||2.0|
|Surface tension (dyne/cm)||62|
|Surface roughness (um)||
Drum side Ra≤0.3
Material Size Rz≤3.0
|Anti oxidization (180℃ Heating 1h)||
No oxidation, No color Change, No Fracture
|Coating performance||Uniform tension on copper foil both sides, uniform slurry coating|
1. Engraving Copper Foil to Give Large‐Scale Binder‐Free Porous CuO Arrays for a High‐Performance Sodium‐Ion Battery Anode, Adv. Mater., 26: 2273-2279
2. Hierarchical 3D-flower-like CuO nanostructure on copper foil for supercapacitors,
RSC Adv., 2015,5, 4443-4447
3. Direct fabrication of double-rough chestnut-like multifunctional Sn@C composites on copper foil: lotus effect and lithium ion storage properties, J. Mater. Chem., 2010,20, 8045-8049