Boron Carbide Sputtering Targets Specifications
To add a Cu Backing Plate with Indium Bonding for Sputtering Targets
- Purity: 99.5%
- Density: 2.51g/cc
- Shape: Discs, Plate, Step ( Dia 300mm, Thickness 1mm) Rectangle, Sheet, Step ( Length1000mm,Width 300mm, Thickness 1mm) Tube( Diameter< 300mm, Thickness >2mm, )
- Custom sizes are available.
- Application: B4C in general are used for wear-resistant films and semi-conducting films.
B4C are used as diffusion barriers in both silicon and III-V device technology in multilevel metallization schemes involving aluminum as a second level.