6 inch Sapphire Wafer C-Plane Single or Double Side Polish Al2O3 Single Crystal
Features for 6 in Sapphire Wafer C-Plane Single or Double Side Polish, Prime Grade
- Material: High purity single crystal Al2O3, sapphire wafer.
- Dimension: Φ150 mm ± 0.05 mm, 6 inch
- Thickness: 1300 ± 25 um
- Orientation: C plane (0001) off M (1-100) plane 0.2 ± 0.05 degree
- Primary flat orientation: A plane ± 1 degree
- Primary flat length: 51 mm ± 1 mm
- Total Thickness Variation (TTV): <20 μm
- Bow: <25 μm
- Warp: <25 μm
- Polishing: single side polished (SSP) or double side polished (DSP) Ra < 0.5 nm (by AFM). The reverse side of SSP wafer was fine ground to Ra = 0.8 - 1.2 um.
- Transmittance: 88% +/-1 % @460 nm
- Package: packaged in a class 100 clean room environment, in cassettes of 25 pieces or single wafer containers, under nitrogen atmosphere.
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