2 in Silicon Carbide Wafers 4H N-type SiC Substrates
SKU: WA0309
2 inch diameter Silicon Carbide (SiC) Crystal Substrates, SiC Wafers Specifications
| Grade | Production Grade (P Grade) | Research Grade (R Grade) | Dummy Grade (D Grade) |
| Diameter | 50.8 mm±0.38 mm | ||
| Thickness | 350 μm±25 μm | ||
| Wafer Orientation | On axis: <0001>±0.5° for 4H-N/4H-SI, Off axis: 4.0° toward <1120 > ±0.5° for 4H-N/4H-SI | ||
| Micropipe Density | ≤5 cm-2 | ≤15 cm-2 | ≤50 cm-2 |
| Resistivity | 0.015~0.028 Ω·cm | ||
| >1E5 Ω·cm | |||
| Primary Flat Orientation | {10-10} ±5.0° | ||
| Primary Flat Length | 15.9 mm ±1.7 mm | ||
| Secondary Flat Length | 8.0 mm ±1.7 mm | ||
| Secondary Flat Orientation | Silicon face up: 90° CW. from Prime flat ±5.0° | ||
| Edge Exclusion | 1 mm | ||
| TTV/Bow /Warp | ≤15 μm /≤25 μm /≤25 μm | ||
| Roughness | C face Polish Ra≤1 nm | ||
| Si face CMP Ra≤0.5 nm | |||
| FEdge Cracks By High Intensity Light | None | 1 allowed, ≤1 mm | |
| Hex Plates By High Intensity Light | Cumulative area≤1 % | Cumulative area≤3 % | |
| Polytype Areas By High Intensity Light | None | Cumulative area≤2 % | Cumulative area≤5% |
| Silicon Surface Scratches By High Intensity Light | 3 scratches to 1×wafer diameter cumulative length |
5 scratches to 1×wafer diameter cumulative length |
8 scratches to 1×wafer diameter cumulative length |
| Edge Chips High By Intensity Light | None | 3 allowed, ≤0.5 mm each | 5 allowed, ≤1 mm each |
| Silicon Surface Contamination By High Intensity | None | ||
| Packaging | Multi-wafer Cassette Or Single Wafer Container | ||
Notes:
* Defect limits are applicable to the entire wafer surface except for the edge exclusion area, where defects are present.
** The scratches are checked on the Si face only.
Inside the wafer case, the side with laser marking of the serial number is the Carbon face. The Si face is facing down and the Carbon face is facing up.
PROPERTIES OF SILICON CARBIDE CRYSTAL MATERIALS
|
Property |
4H-SiC Single Crystal |
6H-SiC Single Crystal |
|
Lattice Parameters (Å) |
a=3.076 c=10.053 |
a=3.073 c=15.117 |
|
Stacking Sequence |
ABCB |
ABCACB |
|
Density |
3.21 |
3.21 |
|
Mohs Hardness |
~9.2 |
~9.2 |
|
Thermal Expansion Coefficient (CTE) (/K) |
4-5 x10-6 |
4-5 x10-6 |
|
Refraction Index @750nm |
no = 2.61 ne = 2.66 |
no = 2.60 ne = 2.65 |
|
Dielectric Constant |
c ~ 9.66 |
c ~ 9.66 |
|
Doping Type |
N-type or Semi-insulating |
N-type or Semi-insulating |
|
Thermal Conductivity (W/cm-K @298K) (N-type, 0.02 ohm-cm) |
a~4.2 c~3.7 |
|
|
Thermal Conductivity (W/cm-K @298K) (Semi-insulating type) |
a~4.9 c~3.9
|
a~4.6 c~3.2
|
|
Band-gap (eV) |
3.23 |
3.02 |
|
Break-Down Electrical Field (V/cm) |
3-5 x 106 |
3-5 x106 |
|
Saturation Drift Velocity (m/s) |
2.0 x 105 |
2.0 x 105 |
|
Wafer and Substrate Sizes |
Wafers: 2, 4, 6, 8 inch; smaller substrates: 10x10, 20x20 mm, other sizes are available and can be custom-made upon request |
|
|
Product Grades |
A Grade Zero micropipe density (MPD < 1 cm-2) B Grade Production grade (MPD < 5 cm-2) C Grade Research grade (MPD < 15 cm-2) D Grade Dummy grade (MPD < 30 cm-2) |
|
Price
MSE Supplies offers the best price on the market for high quality SiC wafers and SiC crystal substrates up to six (6) inch diameter. Our price matching policy guarantees you the best price for the SiC crystal products with comparable specifications. CONTACT US today to get your quote.
Customization
Customized SiC crystal products can be made to meet customer's particular requirements and specifications. Epi-wafers can also be custom made upon request.