A comprehensive range of sizes are available to accommodate the requirements of most popular deposition tools.
physical vapor deposition (PVD) of thin films, laser ablation deposition (PLD), magnetron sputtering for semiconductor, display, LED and photovoltaic devices.
Each target can be designed to fit customer specified backing plates or cups with either indium/tin or silver epoxy bonding. Bonding service is available on oxygen free copper backing plate.
For product quotation, please email: firstname.lastname@example.org
For technical questions: email@example.com
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Indium Bonding on Cu Backing Plate for Sputtering Targets