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Specifications
To add a Cu Backing Plate with Indium Bonding for Sputtering Targets
- Melting point: 2852°C
- Purity: 99.99%
- Density: 3.58 g/cm3
- Solubility: soluble in acid
- Linear expansion coefficient: 10.8 x 10-6/K(300K)
- Specific heat capacity: 0.209 Cal/g.K(273K)
- Hardness: (acc. to Mohs) 5.5, (acc. to Knoop) 692 g/mm2
- Properties of thin film---
- Transmission range 200 - 8000nm
- Refractive index at 550nm 1.73, at 1014nm 1.72, at 2325nm 1.70, at 5138nm 1.63
- Evaporation with electron beam gun.
- Evaporation pressure ~10-3Pa
- Shape---solid substance, White tablets
Specifications for Magnesium Oxide Sputtering Target
- Boiling Point 760 mm Hg: 3600 oC
- Melting Point: 2852 oC
- Specific Gravity: 3.60
- Appearance and Odor: White to gray powder, odorless
- Solubility in H2O: Slightly (<0.1%)
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Magnesium Oxide Sputtering Target Features
- Purity--- 99.99%
- Shape---Discs, Plate,Step (Dia 300mm, Thickness 1mm) Rectangle, Sheet, Step (Length 300mm, Width 300mm, Thickness 1mm)
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Magnesium Oxide Wafer
- Shape--- disk, sheet, tube, step, taper
- Purity--- 99.99%
- Diameter--- 30-300mm
- Length--- 300mm Width: 300mm
- Thickness--- 0.5-100mm
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