AR-P 3250 Thick Positive Resists for Electroplating and Microsystems Technology, 100mL/bottle
AR-P 3250 Thick Positive Resists for Electroplating and Microsystems Technology, 100mL/bottle
Photoresists are in particular used in microelectronics and microsystems technologies for the fabrication of µm- and sub-µm structures.
Features:
- Broadband UV, i-line, g-line
- High photosensitivity, high resolution
- Profiles with high edge steepness dimension accuracy
- Plasma etch resistant, electroplating-stable
- For film thickness up to 20um
- Combination of novolac and naphthoquinone diazide
- Safer Solvent PGMEA
Specifications:
| SKU# | CM8108 |
| Type | AR-P 3250 |
| Layer thickness/4000rpm | 5um |
| Resolution | 1.2um |
| Contrast | 2.5 |
| Flash point | 46℃ |
| Package size | 100mL/bottle |
Note: Store at 10-18℃. Available package size: 100mL, 250mL, 1L.