MSE PRO™ P10/20PPI Porous Copper Metal Foam For Catalysts And Electrode Materials

Description

MSE PRO™ copper foam, characterized by its microporous structure and unique physical and chemical properties, finds widespread applications in various fields. With its lightweight structure and excellent electrical conductivity, copper foam has become a versatile material of choice.

Lightweight Structure: Copper foam's microporous structure provides it with an extremely low density, making it remarkably lightweight. This quality makes copper foam highly valuable in weight-sensitive applications, such as the aerospace and automotive industries.

Excellent Electrical Conductivity: Copper foam exhibits outstanding electrical conductivity, enabling efficient conduction of both current and heat. This attribute makes it widely used in electronic equipment, radiators, and electromagnetic shielding applications.

High Plasticity: Copper foam possesses excellent plasticity, allowing it to be easily shaped and formed into various sizes and geometries. This feature makes it highly suitable for manufacturing components with complex structures, including filters, sound-absorbing materials, and thermal insulation materials.

Superior Corrosion Resistance: Copper foam demonstrates strong resistance to corrosion, protecting it from the detrimental effects of humidity, chemicals, and oxidation. This property makes it extensively employed in marine engineering, chemical industries, and environmental protection applications.

Material	copper
Number of holes	10/20 PPI (Customizable)
Bulk density	0.15-0.45 g/cm3
Size	10010010mm thickness/ 10010020mm thickness
Porosity	90%-98%
Technique	Sintering
Thermal Conductivity (Theoretical)	>6W/M.K
Mechanical Strength (Theoretical)	≥2.5MPa
Tensile Strength (Theoretical)	5-18MPa

The size of this product can be customized. Please contact us with any specific customization requirements.

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