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Physical Vapor Deposition-How to Choose a Suitable Method to Deposit a Thin Film
Posted by Chia-yu Chen on
Physical vapor deposition (PVD) is one of the vacuum deposition methods, which is widely used for surface coatings and thin film fabrication. The most common PVD processes are sputtering and evaporation. To determine a suitable method for deposition, understanding basic deposition principles can be very helpful. Sputtering deposition Sputtering deposition is widely used for metals and ceramics (e.g., oxides and nitrides). In the sputtering process, the target material or cathode is bombarded by high energy ions sputtering off atoms. The ejected atoms are then deposited on the substrate surface. To produce the high energy ions, DC or RF are used as...