Monocrystalline Cubic Boron Nitride (CBN) Superabrasive Powder

Cubic Boron Nitride (CBN) is second only to diamond in hardness but it has two times the thermal stability of diamond. CBN has four times the wear resistance than that of traditional abrasives and its has extraordinary thermal conductivity. It is designed for fine grinding and polishing in a variety of demanding surface finishing applications, such as metal bond grinding wheels, resin bond grinding wheels, vitrified bond wheels and electroplated products.

Material	Cubic Boron Nitride (CBN)
Density (g/cm³)	3.48
Bulk modulus (GPa)	367
Microhardness (GPa)	75-90
Melting point (K)	3500
Expansion coefficient (10⁻⁶/K)	4.7
Thermal conductivity (kW/m·K)	1.3
Thermal stability (K)	1573~1673

In order to choose the optimum monocrystalline CBN super-abrasive powder for your application, please consider the following the following properties:

Power Color
Particle size and particle size distribution (PSD)
Particle shape / morphology / aspect ratio / ellipticity
Toughness and thermal toughness index

MSE Supplies offers a variety of monocrystalline CBN super-abrasive powders with different colors and grain size. The listed below is the powders that we can offer. Please contact us for your specific need.

Color	Strength	Feature	Application	Grain Size (mesh)
Black	Medium	High thermal stability Protruding acute angle High performance and grinding efficiency	Used in resin and vitrified bond system	60-80 80-100 100-120 120-140 140-170 170-200 200-230 230-270 270-325 325-400
Black	Medium	Texture structure surface Good self-sharpness Good surface finish of machined workpiece	Used in resin and vitrified bond system	60-80 80-100 100-120 120-140 140-170 170-200 200-230 230-270 270-325 325-400
Black	Medium	High thermal stability Balanced crushing strength and feature Balanced grinding efficiency and life	Used in vitrified bond system	60-80 80-100 100-120 120-140 140-170 170-200 200-230 230-270 270-325 325-400
Dark brown	High	Sharp acute angle High thermal stability	Used in vitrified, metal and resin bond system with high strength requirement	60-80 80-100 100-120 120-140 140-170 170-200 200-230 230-270 270-325 325-400
Golden	High	High thermal stability	Used in the electroplating tool, metal and vitrified bond system	40-50 50-60 60-80 80-100 100-120 120-140 140-170 170-200 200-230 230-270 270-325 325-400
Amber	Medium	Good self-sharpness	Used in resin bond system	60-80 80-100 100-120 120-140 140-170 170-200 200-230 230-270 270-325 325-400

Reference

1. Recent progress of boron nitrides, Ultra-Wide Bandgap Semiconductor Materials, Materials Today, 2019, Pages 347-419

2. Ultrahard nanotwinned cubic boron nitride. Nature 493, 385–388 (2013)

3. Epitaxy of cubic boron nitride on (001)-oriented diamond. Nature Mater 2, 312–315 (2003)