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4N (99.99%) Tin (Sn) Pellets Evaporation Materials - MSE Supplies LLC

MSE PRO 4N (99.99%) Tin (Sn) Pellets Evaporation Materials

  • $ 9995
  • Save $ 1200


MSE PRO™ 4N (99.99%) Tin (Sn) Pellets Evaporation Materials

Tin (Sn) is a silvery-colored metal. It has two main allotropes: at room temperature, the stable allotrope is β-tin, a silvery-white, malleable metal; at low temperatures, it is less dense grey α-tin, which has the diamond cubic structure. Metallic tin does not easily oxidize in air/water and thus it is used to coat steels to prevent corrosion in old times. It is used in many alloys, most notably tin/lead soft solders and in the manufacture of transparent, electrically conducting films of indium tin oxide in optoelectronic applications. It is usually co-evaporated in different atmospheres or with other materials to form different compound thin films.

The dimensions and purities can be customized upon request. Please contact us for customization or bulk orders

Name Tin
Chemical Formula Sn
CAS # 7440-31-5
SKU# 
  • TA4109: 1/4" Dia. x 1/4" L, 100g
  • TA4110: 1/4" Dia. x 1/4" L, 500g
  • TA4111: 1/8" Dia. x 1/8" L, 100g
  • TA4112: 1/8" Dia. x 1/8" L, 500g
Atomic Number 50
Molecule Weight (g/mol) 118.71
Color/Appearance Silvery Lustrous Gray, Metallic
Purity ≥99.99%, 4N
Thermal Conductivity (W/m.K) 66.6
Coefficient of Thermal Expansion (/K) 22 x 10-6
Melting Point (°C) 232
Theoretical Density (g/cm3) 7.28
Z Ratio 0.724
E-Beam Excellent
Thermal Evaporation Techniques Boat:  Mo
Coil:  W
Basket:  W
Crucible:  Al2O3
E-Beam Crucible Liner Material Graphite, Tantalum
Temp. (°C) for Given Vap. Press. (Torr) 10-8:  682
10-6:  807
10-4:  997

MSE Supplies offers a variety of crucibles for evaporation materials. We can customize the dimensions based on your requirements.

References

1. Studies on tin oxide films prepared by electron beam evaporation and spray pyrolysis methods. Bulletin of Materials Science 27, no. 3 (2004): 295-301.

2. Characteristics of indium tin oxide thin films prepared using electron beam evaporation. Thin solid films 447 (2004): 115-118.