PM — sputtering target

Sputter coating has been widely applied to SEM sample preparation to make non-conductive sample conductive. It is a process for coating thin film on substrate in a vacuum chamber. Factors such as target materials, vacuum pressure and other process parameters can affect film performance. Therefore, selecting a suitable sputter coater is critical. Base pressure Base pressure is an initial vacuum pressure of the chamber. The purpose of vacuum is to remove air contaminants(N2, O2, CO2). Lower vacuum pressure can increase sputtering rate and prevent the target from oxidizing, but high vacuum level usually requires higher cost. Therefore, it is important...