High Purity Metal Sputtering Targets

Available Sputtering Target Dimensions (sizes and shapes)

A comprehensive range of sizes are available to accommodate the requirements of most popular deposition tools.

  • Disk targets, column targets, step wafer targets, plate targets (Dia< 650mm, Thickness> 1mm)
  • Rectangular targets, slice targets, Step rectangular targets (Length <1500mm, Width <300mm, Thickness >1mm)
  • Tubular targets / rotation sputtering target (Outer Diameter < 300mm, Thickness > 2mm)


99.9% (3N), 99.95% (3N5), 99.99% (4N), 99.999% (5N), 99.9995% (5N5), 99.9999% (6N)


physical vapor deposition (PVD) of thin films, laser ablation deposition (PLD), magnetron sputtering for semiconductor, display, LED and photovoltaic devices.

Each target can be designed to fit customer specified backing plates or cups with either indium/tin or silver epoxy bonding.  Bonding service is available on oxygen free copper backing plate.

For product quotation, please email:

For technical questions:

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Thulium Sputtering Target Tm,  MSE Supplies

Thulium Sputtering Target Tm