MSE PRO Dia. 2 inch undoped <100> Ge wafer, 500 µm thick, DSP
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MSE PRO Dia. 2 inch undoped <100> Ge wafer, 500 µm thick, DSP
Limited quantities in stock. Please contact us for the current inventory.
End User Forms are required for each order. Please fill out the forms below:
Product Specification
- Orientation: <100> +/- 1 deg
- Diameter: 50 mm +/- 0.5 mm
- Thickness: 500 um +/- 25 um
- Type/ Dopant: undoped
- Electrical Resistivity: >30 ohm-cm
- Surface Finish: Double Side Polished (DSP)
MSE_SDS Sheet for Ge Wafers and Crystal Substrates
Please contact us if you need to place bulk orders or need customization.