Hiner-pack® 4-inch Teflon Wafer Cassette - PFA

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SKU: MCS-4/25-NP-PFA
Regular price $ 239.95

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Hiner-pack® 4-inch Teflon Wafer Cassette - PFA

Description:

Designed for Wafer Handling in Corrosive or High-Temperature Semiconductor Processes

Engineered for extreme semiconductor manufacturing conditions, PFA wafer cassettes excel in wafer transfer, storage, and wet process cleaning. Constructed from premium perfluoro alkoxy (PFA) or Teflon resin, they offer exceptional resistance to strong acids, hydrofluoric acid, and caustic chemicals, maintaining structural integrity at continuous operating temperatures up to 220 °C. The cassette’s smooth, translucent finish minimizes particle release, simplifies cleaning, and ensures wafer protection throughout processing. Designed to integrate with wafer etchers, wet benches, and SMIF/FOUP-compatible tools, these corrosion-resistant wafer carriers provide reliable, contamination-free handling for high-purity wafer cleaning, etching, and thermal applications in leading semiconductor fabs.

  • Inert PFA/Teflon resists strong acid/base and HF corrosion
  • Withstands temperatures up to approximately 220 °C without degradation or deformation
  • Smooth/translucent surface simplifies cleaning
  • Supports customization (handles, laser engraving, RFID)

Application

  • Handling wafers in high-temperature or corrosive wet processes
  • Use in chemical baths for wafer cleaning or etching
  • Storage of wafers in environments requiring chemical resistance
  • Long-term use in fabs due to superior durability and purity

Specifications

Part Number Collocation Reference Wafer Size
MCS-4/25-NP-PFA -- 4"/100 mm
Material Maximum Capacity Color
PFA 25 Transparent
Delivery Time Usually 2-3 weeks, depending on order quantity

* For more sizes or customization needs, please contact our team. We offer one-stop packaging solutions for your products.

Property Test Method Rated Values
Specific Gravity ASTM D-792 2.12~2.17
Water Absorption ASTM D-570 (24h, 1/3" thick) <0.01%
Molding Shrinkage -- 0.04 cm/cm
Contact Angle Angle with Horizontal Surface 115°
Thermal Conductivity ASTM C-177 --
Coefficient of Linear Thermal Expansion ASTM D-696 (23~60°C) 12x10-5 /°C
Melting Point -- 302~310 °C
Melt Viscosity -- 104~105 /°C (380°C)
Maximum Continuous Use Temperature -- 380°C
Tensile Strength ASTM D-638 (23°C) 27~31 MPa
Elongation ASTM D-638 (23°C) 280~300 %
Compressive Strength ASTM D-695 (1%deformation, 25°C) 5~6 MPa
Tensile Resilience ASTM D-638 (23°C) --
Flexural Resilience ASTM D-790 (23°C) 647~686 MPa
Impact Strength ASTM D-256 (23°C, Izod) --
Hardness Durometer D60 shore
Bearing Deformation ASTM D-621 (100°C, 7MPa, 24h) 2.40%
ASTM D-621 (23°C, 14MPa, 24h) 2.70%
Static Friction Coefficient Against Steel 0.05

* The above data are typical laboratory values and are only used as a reference, not as a guarantee for quality indicators or any other use.

Reference Materials

Hiner-pack® Wafer Carrier Series Catalog

Hiner-pack® MCS-PFA Cassette 100 mm