MSE PRO 6 inch Corning 7980 High Purity Fused SIlica (HPFS) Wafer, 1100 um thick, DSP
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MSE PRO 6 inch Corning 7980 High Purity Fused SIlica (HPFS) Wafer, 1100 um thick, DSP
Introduction
Corning 7980 is a high-purity synthetic amorphous silicon dioxide manufactured via flame deposition. This noncrystalline, transparent silica glass stands out for its impressive optical and thermal properties, making it an excellent choice for applications in the photonics and semiconductor industries. With high transparency across a wide wavelength range, HPFS Corning 7980 performs especially well in UV and visible light, achieving transmission rates typically above 90% from 200 nm to 2,500 nm.
Its low thermal expansion, strong resistance to thermal shock, and high durability against chemical and environmental degradation make it suitable for precision applications.
Key Properties
- Exceptional Optical Transmission – >90% transmission from 200 nm to 2500 nm with low absorption, ideal for UV to near-IR applications.
- Superior Thermal Stability – Ultra-low thermal expansion ensures minimal distortion and reliable performance under temperature fluctuations.
- High Optical Purity – Ultra-pure synthetic silica provides excellent homogeneity, low birefringence, and minimal scattering.
- Excellent Chemical Resistance – مقاust against acids, corrosion, and harsh environments for long-term durability.
- High Laser Damage Resistance – Designed for high-power laser systems including excimer and UV laser applications.

Key Applications
- Semiconductor Industry – Used in photolithography systems, wafer processing equipment, semiconductor inspection systems, and precision optics.
- Photonics Industry – Ideal for optical communication systems, photonic devices, waveguide components, and optical sensors.
- Laser Systems – Suitable for excimer laser optics, laser windows, beam delivery components, and laser resonators.
- Precision Optics Manufacturing – Applied in the production of optical windows, lenses, mirrors, beam splitters, and optical flats.
- Scientific Research – Widely used in spectroscopy instruments, laboratory equipment, analytical devices, and metrology systems.
Specifications
| Diameter/size (or square) | 150 mm |
| Tolerance (±) | 0.2 mm |
| Thickness | 1100 µm |
| Tolerance (±) | 25 µm |
| TTV | < 3 µm |
| Bow | ±30 µm |
| Warp | ≤ 40 µm |
| Edge Rounding | SEMI M1.2 / IEC 62276 compliant |
| Surface Type | DSP |
| Polished side Ra | ≤ 1 nm |
*The photo is for reference only. The appearance might be different due to difference in dimensions.
We also offer various 8-inch wafers. Custom made fused silica and glass substrates are available upon request. Please contact us for a quote.