MSE PRO Ultrasonic Aluminum Wire Bonder
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$ 22,425.95
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MSE PRO™ Ultrasonic Aluminum Wire Bonder
MSE PRO™ Ultrasonic Aluminum Wire Bonder can be used with Microwave devices, RF modules, hybrid circuits, MEMS circuits, optoelectronic devices, sensors, nanodevices, semiconductor devices, radar components, military grade components, specialized circuits, COB/SOB, etc.
Description:
- A compact, desktop-type wire bonding machine characterized by stable performance, ease of operation, and simple maintenance, ideally suited for laboratory environments.
- The MA3386 Ultrasonic Aluminum Wire Bonder (also known as a Wire Bonding Machine) is a precision equipment that achieves electrical interconnection between chips and substrates, and facilitates information exchange among chips, by using fine aluminum wire.
- It employs mechanical pressure and ultrasonic energy to form a metallurgical bond between the aluminum wire and substrate pads. As one of the core devices in electronic micro-assembly processes, it is primarily used in the Chip-on Board (COB) back-end production of precision circuit boards, including applications in LED displays, dot-matrix modules, soft-packaged integrated circuits, thick-film hybrid circuits, transistors, and other semiconductor devices for inner lead bonding.
- The bonding head assembly utilizes a vertical linear guide rail for Z-axis motion, while second-bond displacement (span) is achieved through horizontal motion of the bonding head assembly along a Y-axis linear guide rail. Both motions are driven by imported stepper motors.
- This enables true digital control of first-bond alignment height, wire loop height, and jump distance, ensuring stable welding quality, precise weld point placement, high wire looping repeatability, and consistent loop profile uniformity.
- The second bond can be set for automatic execution; the operator simply presses the weld button on the control pendant, and the machine completes the entire bonding cycle according to pre-configured parameters. This significantly increases welding speed and single-shift productivity.
Specifications:
| Bonding Head | Wire Diameter | 0.7 mil – 3.0 mil (18 µm – 75 µm) |
| Corresponding Capillary | Outer diameter Ø1.6 mm, length 21 mm | |
| Bonding Angle | 45° | |
| Bond Span (Travel Range) | 0 – 10 mm (stepper motor-driven, CNC adjustable) | |
| Wire Loop Height | 0 – 6 mm (CNC adjustable) | |
| Ultrasonic System (Dual Channel) | Ultrasonic Power | 0 – 5 W (continuously adjustable) |
| Welding Time | 5 – 200 ms ±5% (20 ms per division) | |
| Ultrasonic Frequency | 61 kHz ±1 kHz, with automatic frequency tracking | |
| Bonding Force Adjustment Range | 10 – 60 gf (dual channel, electromagnetically controlled) | |
| X-Y-Z Workstage | Rotary Worktable Diameter | 125 mm |
| Bonding Area | 20 × 20 mm | |
| Mouse-Type Control Pendant | Enables 20 × 20 mm travel range | |
| Theta (θ) Rotation Range | ±360° | |
| Minimum X-Y Displacement | 0.1 mil (adjustable) | |
| Minimum Z Displacement | 0.1 mil (adjustable) | |
| Positioning Accuracy | 0.1 mil (achievable by a skilled operator) | |
| General Specifications | Power Supply | AC 220 V ±10% (50 Hz), 60 W |
| Net Weight | 36 kg | |
| Dimensions (L × W × H) | 600 mm × 560 mm × 390 mm | |
| Color | Blue | |
| Microscope | Magnification | Dual magnification levels: 15× and 30× (standard configuration) |
Brand: MSE PRO™
Manufacturer: MSE Supplies LLC
Please contact us for more information.