Proposal Call: $23M FY2017 NSF Materials Research Funding
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Materials Research Science and Engineering CentersPROGRAM SOLICITATION
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Preliminary Proposal Due Date(s) (required) (due by 5 p.m. submitter's local time):
July 01, 2016
Full Proposal Deadline(s) (due by 5 p.m. submitter's local time):
December 02, 2016
SUMMARY OF PROGRAM REQUIREMENTS
General Information
Program Title:
Materials Research Science and Engineering Center (MRSEC)
Synopsis of Program:
Materials Research Science and Engineering Centers (MRSECs) provide sustained support of interdisciplinary materials research and education of the highest quality while addressing fundamental problems in science and engineering. MRSECs address research of a scope and complexity requiring the scale, synergy, and interdisciplinarity provided by a campus-based research center. They support materials research infrastructure in the United States, promote active collaboration between universities and other sectors, including industry and international institutions, and contribute to the development of a national network of university-based centers in materials research, education, and facilities. A MRSEC may be located at a single institution, or may involve multiple institutions in partnership.
Cognizant Program Officer(s):
Please note that the following information is current at the time of publishing. See program website for any updates to the points of contact.
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Daniele Finotello, 1065 N, telephone: (703) 292-4676, email: dfinotel@nsf.gov
Applicable Catalog of Federal Domestic Assistance (CFDA) Number(s):
- 47.049 --- Mathematical and Physical Sciences
Award Information
Anticipated Type of Award: Cooperative Agreement
Estimated Number of Awards: 6 to 8
Anticipated Funding Amount: $23,000,000
The number of MRSEC awards will depend on the quality of the proposals and available funds. An estimate of $23M will be available for the FY 2017 competition for funding approximately 6 to 8 MRSEC awards.
Detailed Award Information:
http://www.nsf.gov/pubs/2016/nsf16545/nsf16545.htm
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