MSE PRO Titanium Nitride Sputtering Target TiN
Specifications for Titanium Nitride Sputtering Target
To add a Cu Backing Plate with Indium Bonding for Sputtering Targets 
Titanium Nitride (TiN) Specifications
| Material Type | Titanium Nitride |
| Symbol | TiN |
| CAS Number | 25583-20-4 |
| Color/Appearance | Yellow-Brown, Crystalline Solid |
| Melting Point (°C) | 2930 |
| Theoretical Density (g/cm3) | 5.4 |
| Molecular Mass (g/mol) | 61.874 |
| Thermal Expansion Coefficient (/°C) | 9.4 x 10^-6 |
| Z Ratio | 1.00 |
| Sputter | RF, RF-R |
| Max Power Density (Watts/Square Inch) |
20 |
| Type of Bond | Indium |
| Comments | Sputtering preferred. Decomposes with thermal evaporation. |
| Applications | TiN sputtering targets are used to make coatings, which are for edge retention and corrosion resistance on machine tooling, such as drill bits and milling cutters, often improving their lifetime by a factor of three or more. Though less visible, thin films of TiN are also used in microelectronics, where they serve as a conductive connection between the active device and the metal contacts used to operate the circuit, while acting as a diffusion barrier to block the diffusion of the metal into the silicon. Owing to their high biostability, TiN layers may also be used as electrodes in bioelectronic applications. |
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