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MSE PRO Titanium Nitride Sputtering Target TiN– MSE Supplies LLC

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MSE PRO Titanium Nitride Sputtering Target TiN

MSE PRO Titanium Nitride Sputtering Target TiN

SKU: TA4270

  • $ 57095
  • Save $ 6900



To add a Cu Backing Plate with Indium Bonding for Sputtering Targets  

Titanium Nitride (TiN) Specifications

Material Type Titanium Nitride
Symbol TiN
CAS Number 25583-20-4
Color/Appearance Yellow-Brown, Crystalline Solid
Melting Point (°C) 2930
Theoretical Density (g/cm3) 5.4
Molecular Mass (g/mol) 61.874
Thermal Expansion Coefficient (/°C) 9.4 x 10^-6
Z Ratio 1.00
Sputter RF, RF-R
Max Power Density
(Watts/Square Inch)
20
Type of Bond Indium
Comments Sputtering preferred. Decomposes with thermal evaporation.
Applications TiN sputtering targets are used to make coatings, which are for edge retention and corrosion resistance on machine tooling, such as drill bits and milling cutters, often improving their lifetime by a factor of three or more.  Though less visible, thin films of TiN are also used in microelectronics, where they serve as a conductive connection between the active device and the metal contacts used to operate the circuit, while acting as a diffusion barrier to block the diffusion of the metal into the silicon. Owing to their high biostability, TiN layers may also be used as electrodes in bioelectronic applications.