MSE PRO BSDM 3D Super-Depth Digital Microscope
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MSE PRO BSDM 3D Super-Depth Digital Microscope
Introduction
The MSE PRO BSDM 3D Super-Depth Digital Microscope is a high-performance digital imaging and measurement system designed for advanced microscopic observation, 2D/3D imaging, and precision analysis. It delivers super-depth imaging, rapid autofocus, motorized operation, and powerful image processing functions to support detailed inspection of a wide range of samples. The system is designed to provide efficient observation, accurate measurement, and an intuitive user experience for research, industrial inspection, electronics analysis, materials characterization, and quality control.
Key Features
- 3D super-depth imaging for clear observation of complex surfaces and uneven samples.
- Wide magnification range from 20X to 7500X with smooth and rapid switching.
- Automatic frame hovering and ±90° angle control for flexible observation without tilting the sample.
- Fast autofocus and real-time continuous focusing for sharp, detailed imaging.
- Multiple illumination and observation modes including bright field, dark field, polarization, DIC, coaxial illumination, ring light, and transmitted illumination.
- Professional APO telecentric objectives for high-resolution imaging and high-precision measurement with minimized perspective error.
- Real-time depth-of-field fusion, HDR, glare reduction, and reflection transformation for enhanced image quality.
- 2D and 3D image stitching for large-area imaging, with stitched image sizes up to 100,000 × 100,000 pixels.
- Advanced 2D and 3D measurement tools including distance, angle, area, contour, height, surface area, volume, particle analysis, roughness analysis, and cross-field rapid measurement.
- Report generation and CSV export for streamlined documentation and workflow integration.
Specifications
Optical and Imaging
| Parameter | Specification |
|---|---|
| Magnification Range | 20X to 7500X |
| Camera | 4K CMOS sensor / 12 MP color camera |
| Imaging Modes | 2D imaging, 3D imaging, depth-of-field fusion, 2D stitching, 3D stitching |
| Observation Modes | Bright field, dark field, polarization, DIC |
| Illumination | Ring light, coaxial illumination, transmitted LED cold light |
Objectives
| Objective | Total Magnification | Working Distance |
|---|---|---|
| 2X Plan APO | 20X–100X | 18.0 mm |
| 10X Plan APO | 100X–500X | 32.0 mm |
| 20X Plan APO | 200X–1000X | 15.0 mm |
| 50X Plan APO | 500X–2500X | 6.3 mm |
| 100X Plan APO | 2500X–7500X | 1.5 mm |
Stage and Motion
| Parameter | Specification |
|---|---|
| Stage Type | Motorized stage |
| Travel Precision | 0.1 μm |
| Max Moving Speed | Up to 20 mm/s or 40 mm/s depending on stage configuration |
| Rotation Function | Selected configurations support ±90° rotation |
| Z-Axis | Motorized Z-axis available |
| Rotation Precision | 1° |
Software Functions
| Function Category | Functions |
|---|---|
| Imaging | Auto focus, depth-of-field fusion, 3D imaging, navigation system, HDR, glare reduction, anti-shake, focus tracking |
| Measurement | 2D measurement, intelligent measurement, cross-field measurement, 3D contour measurement, point height measurement, volume measurement |
| Analysis | Particle counting, area measurement, surface roughness analysis, cleanliness analysis |
| Data Output | CSV report export, shooting condition recall, time-lapse capture, video recording |
Computer and Software
| Parameter | Specification |
|---|---|
| Computer | 28-inch all-in-one PC |
| Resolution | 4K |
| CPU | i7 |
| Memory | 32 GB |
| Storage | 512 GB + 1 TB |
| Included | Wireless mouse, keyboard, software, USB dongle |
Applications
The MSE PRO BSDM 3D Super-Depth Digital Microscope is suitable for:
- Electronics and PCB inspection
- Semiconductor and chip observation
- Metallographic and materials analysis
- Surface profile and roughness measurement
- Coating and paint layer inspection
- Weld and package point analysis
- Glass substrate groove depth measurement
- Document and handwriting indentation inspection
- Particle counting and contamination analysis
- General research, failure analysis, and quality control
These applications are supported by the sample images and measurement examples shown in the document, including circuit boards, screws, needles, chip observation, paint layers, grooves on glass substrates, contact observation, and 3D metal bead measurement.
Included Items
Standard system components include controller, PC and software package, CAN card/USB docking station, internal hexagonal spanners, packaging, dust cover, and selected microscope hardware depending on the chosen BSDM configuration.
Optional Accessories
Optional items may include additional objectives, polarizing attachments, DIC kits, diffusion illumination adapters, circular standard boards, alternative stages, and frame or Z-axis options depending on the configuration.