Applications:
- Non-linear Optics
- Electro–optics Modulators
- Ferroelectric Memory Devices
- Others
Specification:
| General Wafer | |
| Structure | MgO-LiNbO3/ Oxide / Si |
| Diameter | Φ100 ± 0.2 mm |
| Thickness | 525 ± 25 μm |
| Primary Flat Length | 32.5 ± 2 mm |
| Wafer Beveling | R Type |
| TTV | < 5 μm |
| LTV | < 1.5 μm (5∗5 mm2) / 100% |
| Bow | ± 50 μm |
| Warp | < 50 μm |
| Edge Trimming | 2 ± 0.5 mm |
| Lithium Niobate Layer | |
| Average Thickness |
300 nm (WA4011) Other thicknesses are available upon request |
| Orientation | X axis ± 0.5° |
| Primary Flat Orientation | Z axis ± 1° |
| Doping | MgO (5mol%) |
| Front Surface Roughness (Ra) | < 1 nm |
| Bond Defects | > 1 mm None ; ≦ 1 mm within 80 total |
| Front Surface Scratch |
> 1 cm None ; ≦ 1 cm within 3 total |
| Oxide Layer | |
| Thickness | 4700 ± 150 nm |
| Uniformity | ± 5% |
| Substrate | |
| Material | Si |
| Orientation | <100> ± 1° |
| Primary Flat Orientation | <110> ± 1° |
| Resistivity | > 10 kΩ·cm |
| Backside | Etched-Oxide |