MSE PRO Barium Titanate Sputtering Target BaTiO3
Barium Titanate (BaTiO3) Sputtering Target Specifications
To add a Cu Backing Plate with Indium Bonding for Sputtering Targets 
| Material Type | Barium Titanate |
| Chemical Formula |
BaTiO3 |
| Purity (%) | 99.9 |
| Melting Point (°C) | 1,625 |
| Theoretical Density (g/cm3) | 6.02 |
| Relative Density (%) | 85 |
| Z Ratio | 0.464 |
| Sputter | RF |
| Max Power Density (Watts/Square Inch) |
20 |
|
Type of Bond (please contact us for Cu backing plate and bonding service) |
Indium |