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MSE PRO 6 Inch Lithium Tantalate Thin Film on Insulator Wafers (LTOI), Thin Films, MSE Supplies LLC, MSE Supplies

MSE PRO 4 Inch Lithium Tantalate Thin Film on Insulator Wafers (LTOI) X-cut

SKU: WA4023

  • $ 5,05995
  • Save $ 60719

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MSE PRO™ 4 Inch Lithium Tantalate Thin Film on Insulator Wafers (LTOI) X-cut

MSE Supplies offers Premium 4 inch Lithium Tantalate (LiTaO3) Thin Film on Insulator (LTOI). It typically consists of a thin layer of LiTaO3 on an insulating substrate. The insulator layer between the LTOI thin film and silicon wafer helps to prevent the chance of occurring short circuits and enhancing the material's electrical performance. The LTOI wafer has piezoelectric properties, which makes it an ideal for the conversion of mechanical energy into electrical energy. It is widely used in making surface acoustic wave (SAW) filters, sensors, actuators, and resonators.

Specification:

      General Wafer
      Structure LiTaO3 / Oxide / Si
      Diameter Φ100 ± 0.2 mm
      Thickness 525 ± 20 μm
      Primary Flat Length 32.5 ± 2 mm
      Wafer Beveling R Type
      TTV < 10 μm
      LTV < 1.5 μm (5∗5 mm2) / 95%
      Bow  ± 50 μm
      Warp < 50 μm
      Edge Exclusion 5 mm
      Edge Trimming 2 ± 0.5 mm
      Lithium Tantalate Layer
      Average Thickness 600 ± 20 nm
      Orientation X axis ± 0.3°
      Primary Flat Perpendicular to +Z Axis ± 1°
      Front Surface Roughness (Ra) < 0.5 nm
      Defects

      Within 150 total
      Isolation SiO2 Layer
      Thickness 4700 ± 100 nm
      Uniformity <100nm @17 points
      Substrate
      Material Si
      Resistivity > 10 kΩ·cm
      Orientation <100> ± 1°
      Primary Flat Orientation <110> ± 1° 
      Backside Etched

        Please contact us for bulk order or customized shape, size, thickness and substrate. 

        References:

        Low-loss lithium tantalate on insulator waveguide towards on-chip nonlinear photonics. In 2022 27th OptoElectronics and Communications Conference (OECC) and 2022 International Conference on Photonics in Switching and Computing (PSC) (pp. 1-3). IEEE.