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MSE PRO 4 inch Aluminum-Copper (Al-Cu) Thin Film on Silicon Wafer - MSE Supplies LLC

MSE PRO 4 inch Aluminum-Copper (Al-Cu) Thin Film on Silicon Wafer

  • £21900
  • Save £2300

MSE PRO™ 4 inch Aluminum-Copper (Al-Cu) Thin Film on Silicon Wafer

Aluminum-copper (Al-Cu) alloys have become a popular choice for interconnects in integrated circuits due to their excellent conductivity and processing capabilities. Al-Cu thin films are renowned for their exceptional thermal stability, superior conductivity, and minimal resistivity.

Specifications:

Size 4 inch
Substrate Silicon wafer
Substrate Thickness 775 um +/- 25um
Substrate Doping Type P-type/ Boron-doped
Substrate Orientation <100>
Substrate Resistivity 1-100 ohm-cm
Deposition Method PVD
Substrate Surface
 Single Side Polished
Thin Film Material Aluminum-Copper (Al-Cu)
Thin Film Thickness 50 nm - 1500 nm customizable

Reference:

[1] J.P. Lokker, A.J. Bottger, W.G. Sloof, et al. Phase transformations in Al-Cu Thin films: precipitation and copper redistribution, Acta meter, 49 (2001) 1339-1349.

[2] Fanta Haidara, Marie-Christine Record, Benjamin Duployer, Dominique Mangelinck, Investigation of reactive phase formation in the Al–Cu thin film systems, Surface and Coatings Technology, Volume 206, Issues 19–20, 2012, Pages 3851-3856.

[3] Tatu Pinomaa, Joseph M. McKeown, Jörg M.K. Wiezorek, Nikolas Provatas, Anssi Laukkanen, Tomi Suhonen, Phase field modeling of rapid resolidification of Al-Cu thin films, Journal of Crystal Growth, Volume 532, 2020, 125418.