Hiner-pack® 8-inch Wafer Jar with Foam, Interleaf and Liner
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Hiner-pack® 8-inch Wafer Jar with Foam, Interleaf and Liner
Description:
Engineered for safe handling of delicate wafers during shipping and storage
Wafer jars provide an economical and reliable multi-wafer storage and transport solution, ideal for non-sensitive wafers in semiconductor production. Made from durable natural polypropylene, each jar is equipped with a secure-fitting lid to prevent accidental opening. Inside, a layered protection system—including interleaf separators, foam cushion disks, and liner foam walls—shields wafers from vibration, shock, and surface contact. Available in 150mm and 200mm sizes (custom sizes available), and offered in clear, white, or black for inspection or ESD control. Their stackable design optimizes cleanroom space, while the reusable construction reduces packaging waste. Perfect for in-fab storage and inter-fab wafer shipping, these jars ensure contamination prevention and physical protection for high-value wafers.
- Interleaf separators prevent direct wafer surface contact
- Foam liners and cushion disks absorb shocks and vibration
- The bottom and the top cover are designed to facilitate the operator to open and ensure safety during transportation
Application:
- Bulk wafer storage and transport
- Cleanroom-based manual packing
- Multiple wafer protection during shipment
- Cost-effective solution for non-sensitive wafer handling
Specification:
| Basic Information | ||
| Part Number | Collocation Reference | Wafer Size |
| MHWJ-8/25-203/50-WH | Bottom+Foam+Interleaf+Liner+Top | 8"/200 mm |
| Material | Maximum Capacity | Color |
| PP | 25 | Transparent Bottom+White Cover |
| Delivery Time | Usually 2-3 weeks, depending on order quantity | |
| * For more sizes or customization needs, please contact our team. We offer one-stop packaging solutions for your products. | ||
| Technical Data | ||
| Property | Test Method | Rated Values |
| Density | ISO 1183 | 0.9 g/cm³ |
| Melt Index | ISO 1133 | 15 g/10min |
| Melting Point | DSC | 146°C |
| Distortion Temperature | ISO 75 | 95°C |
| Vicat softening temperature | ISO 306 | 125°C |
| Tensile Strength at Yield | ISO 527 | 280 kg/m² |
| Tensile Elongation at Break | ISO 527 | 300% |
| Rockwell hardness R scale | ISO 2039 | 98 |
| Tensile Strain at Break | ISO 527-2 (50mm/min) | 10% |
| Flexural Modulus | ISO 178 | 10500 kg/m² |
| Flow Shrinkage | FPC Method | 1.3~1.7 % |
| LZOD Impact Strength | ISO 180/23°C ISO 180/-20°C | 6kg.cm/cm --- notch |
* The above data are typical laboratory values and are only used as a reference, not as a guarantee for quality indicators or any other use.