Hiner-pack® Snap-on Cover/Lid For 4-inch Waffle Pack (101.6×101.6×4.5)mm
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Hiner-pack® Snap-on Cover/Lid For 4-inch Waffle Pack (101.6×101.6×4.5)mm
Introduction
The Hiner-pack® Snap-on Cover/Lid for 4-inch waffle packs (101.6 × 101.6 × 4.5 mm) is engineered to provide secure, clean, and reliable protection for semiconductor die during storage and transport. Available in static-dissipative, conductive, and standard ESD-safe materials, with options for transparent or opaque finishes, it supports both easy visual inspection and light-sensitive applications. Manufactured from high-purity, cleanroom-compatible polymers with low outgassing and minimal particulate generation, the lid ensures contamination control in critical environments. Its dimensionally stable design helps offset tray warpage, while the durable, reusable construction enhances cost efficiency. Designed to integrate seamlessly with standard clips, the snap-on lid firmly compresses the waffle pack to prevent die migration and ensure safe handling throughout the supply chain.
Application
Hiner-pack waffle pack cover/lid is used to safeguard bare die, thin film substrates, ceramic components, or precision shims stored in industry-standard waffle packs and chip trays. It prevents damage, particle contamination, and loss of alignment during handling, shipping, and long-term inventory, ensuring devices remain securely seated and free from mechanical or environmental stress throughout the semiconductor packaging process.
Specifications
| Part Number | HN1957 |
| Tray Size & Function | 4" Cover/Lip |
| Style | / |
| Color | Black / Transparent |
| Capacity | N/A |
| Material | PC |
| Outline Size | 101.6×101.6×4.5mm |
For more sizes or customization needs, please contact us for more information.
*Actual product appearance may vary from the image shown.