Hiner-pack® Cover/Lid For 2-inch Waffle Pack (50.7×50.7×3.5)mm, Reverse Side with Grid-like Bumps

Hiner-pack® Cover/Lid For 2-inch Waffle Pack (50.7×50.7×3.5)mm, Reverse Side with Grid-like Bumps

Introduction

The Hiner-pack® Cover/Lid for 2-inch waffle packs (50.7 × 50.7 × 3.5 mm) is a precision-engineered solution designed to protect delicate semiconductor dice during shipping and handling. Featuring a reverse side with grid-like bumps, this cover works in tandem with a specialized clip to apply uniform compression across the tray, effectively preventing components from shifting out of their pockets. Available in static-dissipative, conductive, or standard ESD-safe grades, the lid supports a wide range of electrostatic protection requirements. Material options include both transparent and opaque variants, allowing for easy visual inspection or enhanced light shielding depending on application needs. Manufactured from high-purity polymers, the cover ensures low outgassing, minimal particulate generation, and full compatibility with cleanroom environments.

In addition, the lid offers excellent dimensional stability to counteract typical tray warpage, maintaining consistent performance over repeated use. Its durable, reusable construction makes it a cost-efficient choice for high-volume semiconductor packaging operations, delivering reliable protection without compromising operational efficiency.

Application

The Hiner-pack® Cover/Lid for 2-inch waffle packs (50.7 × 50.7 × 3.5 mm) is used to protect bare die, thin film components, and other fragile devices from particle intrusion, scratches, and displacement within tray pockets, maintaining cleanliness and positional stability throughout wafer-level packaging, R&D sampling, in-process storage, and secure transit between facilities.

Specifications

For more sizes or customization needs, please contact us for more information.

Reference Materials:

Hiner-pack® 2-inch Waffle Pack & Chip Tray Catalog