Hiner-pack® 6-inch Teflon Wafer Cassette - PFA
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Hiner-pack® 6-inch Teflon Wafer Cassette - PFA
Description:
PFA Wafer Cassettes for High-Purity Semiconductor Wet Processes
PFA wafer cassettes provide unmatched performance in the transfer, storage, and cleaning of semiconductor wafers during high-temperature wet processing and corrosive chemical applications. Molded from high-purity perfluoroalkoxy (PFA) or Teflon resin, these wafer carriers withstand prolonged exposure to strong acids, hydrofluoric acid, and alkaline solutions at temperatures up to 220 °C without warping or contamination. The smooth, translucent surfaces reduce particle generation and enable easy cleaning, safeguarding wafer quality during critical process steps. Compatible with standard wafer handling systems, wet benches, and SMIF/FOUP interfaces, PFA cassettes deliver outstanding chemical resistance, dimensional stability, and ultra-clean performance for advanced wafer etching, cleaning, and processing environments.
- Inert PFA/Teflon resists strong acid/base and HF corrosion
- Withstands temperatures up to approximately 220 °C without degradation or deformation
- Smooth/translucent surface simplifies cleaning
- Supports customization (handles, laser engraving, RFID)
Application
- Handling wafers in high-temperature or corrosive wet processes
- Use in chemical baths for wafer cleaning or etching
- Storage of wafers in environments requiring chemical resistance
- Long-term use in fabs due to superior durability and purity
Specifications
| BASIC INFORMATION | ||
| Part Number | Collocation Reference | Wafer Size |
| MCS-6/25-NP-PFA | -- | 6"/150 mm |
| Material | Maximum Capacity | Color |
| PFA | 25 | Transparent |
| Delivery Time | Usually 2-3 weeks, depending on order quantity | |
* For more sizes or customization needs, please contact our team. We offer one-stop packaging solutions for your products.
| TECHNICAL DATA | ||
| PROPERTY | TEST METHOD | RATED VALUES |
| Specific Gravity | ASTM D-792 | 2.12~2.17 |
| Water Absorption | ASTM D-570 (24h, 1/3" thick) | <0.01% |
| Molding Shrinkage | -- | 0.04 cm/cm |
| Contact Angle | Angle with Horizontal Surface | 115° |
| Thermal Conductivity | ASTM C-177 | -- |
| Coefficient of Linear Thermal Expansion | ASTM D-696 (23~60°C) | 12x10-5 /°C |
| Melting Point | -- | 302~310 °C |
| Melt Viscosity | -- | 104~105 /°C (380°C) |
| Maximum Continuous Use Temperature | -- | 380°C |
| Tensile Strength | ASTM D-638 (23°C) | 27~31 MPa |
| Elongation | ASTM D-638 (23°C) | 280~300 % |
| Compressive Strength | ASTM D-695 (1%deformation, 25°C) | 5~6 MPa |
| Tensile Resilience | ASTM D-638 (23°C) | -- |
| Flexural Resilience | ASTM D-790 (23°C) | 647~686 MPa |
| Impact Strength | ASTM D-256 (23°C, Izod) | -- |
| Hardness | Durometer | D60 shore |
| Bearing Deformation | ASTM D-621 (100°C, 7MPa, 24h) | 2.40% |
| ASTM D-621 (23°C, 14MPa, 24h) | 2.70% | |
| Static Friction Coefficient | Against Steel | 0.05 |
* The above data are typical laboratory values and are only used as a reference, not as a guarantee for quality indicators or any other use.
Reference Materials
Hiner-pack® Wafer Carrier Series Catalog
Hiner-pack® 6-inch Teflon Wafer Cassette-PFA