MSE PRO Fully Automatic Wafer Stage Contact Angle Goniometer

MSE PRO Fully Automatic Wafer Stage Contact Angle Goniometer

Introduction

The MSE PRO Fully Automatic Wafer Stage Contact Angle Goniometer is a high-end system designed for automated wettability analysis of large-format samples, including semiconductor wafers up to 12 inches. Featuring a fully automated 3D motion stage with 360° rotation and programmable multi-point measurement, it enables precise and repeatable surface characterization across the entire sample.

Equipped with an ultra-high-resolution imaging system and a software-controlled micro-injection module (0.01 μL accuracy), the system supports advanced analysis including static and dynamic contact angle, surface free energy, and interfacial tension. Its one-click automated workflow allows for high-throughput testing, generating over 100 data points on a single wafer, making it ideal for semiconductor manufacturing, coatings, and advanced materials research.

Key Features

• Fully automated 3D wafer stage with 360° rotation (0.01° precision)

• Supports up to 12-inch wafer measurement

• Programmable multi-point testing (>100 data points per wafer)

• High-precision dosing system (0.01 μL, software-controlled)

• Ultra-high-resolution imaging (5120 × 3840)

• High-speed imaging up to 300 fps (upgradeable)

• One-click automated measurement and analysis

• Advanced surface energy and interfacial tension analysis

• Designed for high-throughput and high-repeatability applications

Specification

MSE offers a range of contact angle goniometer models. Please contact us for more information.