MSE PRO Dia. 4'' JGS2 Fused Silica Wafer, 700 μm Thick, DSP, w/ Bevel, Primary Flat Only
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MSE PRO Dia. 4'' JGS2 Fused Silica Wafer, 700 μm Thick, DSP, w/ Bevel, Primary Flat Only
Introduction
Fused silica (SiO2) wafers are made from high purity fused silica, ground and polished to optical grade on both sides. The fused silica wafers are suitable for many optical applications because of their excellent optical transmission characteristics. Fused silica also has excellent chemical resistance against a wide variety of solvents, as well as exceptional heat resistance, with high dimensional stability over a wide temperature range thanks to its ultra low thermal expansion coefficient.
Specifications
| Specification Category | Details |
|---|---|
| Material | SiO₂, Fused Silica (Fused Quartz) |
| Grade | JGS2 (Optical Grade Fused Silica) |
| Wafer Diameter | 100 ± 0.2 mm |
| Wafer Thickness | 700 ± 25 µm |
| Primary Flat | 22 ± 2.0 mm (primary flat only) |
| Surface Polishing | Double Side Polished (DSP) |
| Surface Roughness | Ra < 1 nm on both top and bottom surfaces |
| Surface Finish | S/D 40/20 |
| Total Thickness Variation (TTV) | < 10 µm |
| Edge Type | Beveled edge |
| Edge Processing | C-shape CNC edge grinding |
Physical Properties of Fused Silica
- Density: 2.2 g/cm3
- Coefficient of Thermal Expansion: 5.8*10^-7 /k (298 ~ 573 deg K)
- Thermochromism: Under constant temperature of 1140 degrees, keep annealing for 30 minutes without discoloration.
The JGS2 fused silica is equivalent to Homosil 1, 2 & 3 (Heraeus), Dynasil 1000 & 4000 and 5000 & 6000 (Dynasil)
- 8 '' inch JGS2 Fused Silica wafers are also available. Custom made JGS fused silica wafers and substrates are available upon request. Please contact us for a quote.
- Corning Fused Silica 7980 High Purity Fused Silica (HPFS) and JGS1 Fused Silica wafers, windows and substrates are also available and can be custom made. Please contact us for a quote.