MSE PRO Benchtop Vacuum Plasma Cleaning System
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MSE PRO Benchtop Vacuum Plasma Cleaning System
Introduction
The MSE PRO Benchtop Vacuum Plasma Cleaning System is a compact, high-efficiency solution for surface cleaning, activation, and modification. By generating low-temperature plasma under vacuum conditions, it effectively removes organic contaminants, improves surface energy, and enhances adhesion performance for a wide range of materials.
Designed with an integrated vacuum system, plasma generator, and PLC-based control interface, the system provides stable, uniform treatment with easy operation. Its flexible fixture design and horizontal electrode configuration make it suitable for both rigid and flexible samples. Ideal for applications in semiconductors, electronics, PCB/FPC processing, coatings, and advanced materials, this system delivers reliable and environmentally friendly surface treatment.
Key Features
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Compact benchtop design with integrated vacuum system
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Low-temperature plasma for efficient surface cleaning and activation
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Uniform treatment with optimized chamber and electrode design
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PLC control with intuitive touchscreen interface
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Supports automatic and manual operation modes
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Flexible fixture design for irregular and diverse sample types
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Low energy and gas consumption
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Stable and environmentally friendly processing
Specification
| 1. General | |
| Model | MSE PRO Benchtop Vacuum Plasma Cleaning System |
| Main Unit Dimensions | 460 × 482 × 460 mm |
| Vacuum Pump Dimensions | 380 × 135 × 280 mm |
| Weight | 62 kg (Main Unit + Pump) |
| 2. Power Requirements | |
| Power Supply | AC 380V, 60 Hz |
| Current | 25 A (recommended circuit breaker C-type or above) |
| Power | 0–300 W (plasma generator) |
| Frequency | 40 kHz / 25 kHz |
| 3. Vacuum System | |
| Vacuum Pump | Dual-stage rotary vane pump |
| Pumping Speed | 8 m³/h |
| Vacuum Range | 20–100 Pa (operating range) |
| Pipeline | PU tubing |
| Sealing | Military-grade welded sealing |
| 4. Chamber | |
| Chamber Material | Aluminum alloy |
| Chamber Dimensions | 390 × 310 × 120 mm |
| Electrode Size | 360 × 270 mm |
| Electrode Type | Horizontal electrode |
| Working Layers | 1 layer |
| Working Tray | Standard included |
| Usable Height | 70 mm |
| 5. Gas System | |
| Gas Type | Air (standard) or custom gas |
| Flow Range | 0–300 SCCM |
| Gas Line | 1 channel (standard) |
| Optional Gas Supply | 1–10 L/min, 99.99% purity |
| 6. Control System | |
| Controller | PLC |
| Interface | 7-inch touchscreen |
| Operation Modes | Automatic / Manual |
| Process Flow | Vacuum → Gas → Plasma → Vent |
| 7. Processing Capability | |
| Process Type | Cleaning, activation, etching, surface modification |
| Applicable Materials | Metals, polymers, ceramics, semiconductors |
| Treatment Uniformity | Optimized chamber design |
| 8. Facility Requirements | |
| Power Input | 380V |
| Exhaust | 2.0 m³/min (optional) |
| Gas Pressure | 1–2 kg/cm² |
| Gas Purity | ≥99.99% |
MSE offers a range of contact angle goniometer models. Please contact us for more information.