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MSE PRO 4 inch Titanium (Ti) Thin Film on Silicon Wafer - MSE Supplies LLC

MSE PRO 4 inch Titanium (Ti) Thin Film on Silicon Wafer

  • $ 26995
  • Save $ 3300

MSE PRO™ 4 inch Titanium (Ti) Thin Film on Silicon Wafer

Titanium (Ti), due to its interesting properties such as high mechanical strength, excellent thermal stability, good corrosion resistance in extreme conditions and intrinsic biocompatibility is a potential candidate used as bulk or coatings in biomedical, aerospace and other industrial applications. Furthermore, titanium coatings are employed for microelectronics applications in very large scale integration (VLSI) technology and microelectromechanical system (MEMS) based devices. 

Specifications:

Size 4 inch
Substrate Silicon wafer
Substrate Thickness 775 um +/- 25um
Substrate Doping Type P-type/ Boron-doped
Substrate Orientation <100>
Substrate Resistivity 1-100 ohm-cm
Deposition Method PVD
Substrate Surface
 Single Side Polished
Thin Film Material Titanium (Ti)
Thin Film Thickness 50 nm - 300nm customizable

Reference:

[1] Y.L. Jeyachandran, B. Karunagaran, Sa.K. Narayandass, D. Mangalaraj, T.E. Jenkins, P.J. Martin, Properties of titanium thin films deposited by dc magnetron sputtering, Materials Science and Engineering: A, Volume 431, Issues 1–2, 2006, Pages 277-284.

[2] Kaiyong Cai, Michael Müller, Jörg Bossert, Annett Rechtenbach, Klaus D. Jandt, Surface structure and composition of flat titanium thin films as a function of film thickness and evaporation rate, Applied Surface Science, Volume 250, Issues 1–4, 2005, Pages 252-267.