To better serve you, we would like to discuss your specific requirement, Please Contact Us for a quote.
Base Indent and Cleaving System
By using the Patented LatticeAx base platform, every user can achieve high quality cleaves within 2 minutes for samples that vary in size, thickness and material. Use the 120 to cleave silicon, GaAs, glass, sapphire, hard disk drives and other substrates.
With the LatticeAx 120, you literally have in the palm of your hand a versatile and powerful cleaving tool for downsizing and cross sectioning a wide range of substrates including Silicon, GaAs, InP, Sapphire, Glass, and Hard Disk Drives. With the LatticeAx, you can cleave your samples as they are, without additional preparation, and strict rules on the size, shape, thickness, edge quality and material type.