{"product_id":"mse-pro-4-inch-aluminum-silicon-copper-al-si-cu-thin-film-on-silicon-wafer","title":"MSE PRO 4 inch Aluminum-Silicon-Copper (Al-Si-Cu) Thin Film on Silicon Wafer","description":"\u003ch2\u003eMSE PRO™ 4 inch Aluminum-Silicon-Copper (Al-Si-Cu) Thin Film on Silicon Wafer\u003c\/h2\u003e\n\u003cp\u003e\u003cspan\u003e The \u003c\/span\u003eAluminum-Silicon-Copper (Al-Si-Cu) \u003cspan\u003ethin films are commonly used as interconnects in integrated circuits (ICs) and microelectronic devices. The use of Al-Cu-Si thin films on silicon substrates contributes to the development of high-performance semiconductor devices with enhanced electrical and structural properties.\u003c\/span\u003e\u003c\/p\u003e\n\u003ch3\u003e\u003cstrong\u003eSpecifications:\u003c\/strong\u003e\u003c\/h3\u003e\n\u003ctable style=\"width: 562px;\"\u003e\n\u003ctbody\u003e\n\u003ctr\u003e\n\u003ctd style=\"width: 248.992px;\"\u003eSize\u003c\/td\u003e\n\u003ctd style=\"width: 294.008px;\"\u003e4 inch\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd style=\"width: 248.992px;\"\u003eSubstrate\u003c\/td\u003e\n\u003ctd style=\"width: 294.008px;\"\u003eSilicon wafer\u003cbr\u003e\n\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd style=\"width: 248.992px;\"\u003eSubstrate Thickness\u003c\/td\u003e\n\u003ctd style=\"width: 294.008px;\"\u003e\u003cspan\u003e775 um +\/- 25um\u003c\/span\u003e\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd style=\"width: 248.992px;\"\u003eSubstrate Doping Type\u003c\/td\u003e\n\u003ctd style=\"width: 294.008px;\"\u003eP-type\/ Boron-doped\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd style=\"width: 248.992px;\"\u003eSubstrate Orientation\u003c\/td\u003e\n\u003ctd style=\"width: 294.008px;\"\u003e\u0026lt;100\u0026gt;\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd style=\"width: 248.992px;\"\u003eSubstrate Resistivity\u003c\/td\u003e\n\u003ctd style=\"width: 294.008px;\"\u003e1-100 ohm-cm\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd style=\"width: 248.992px;\"\u003eDeposition Method\u003c\/td\u003e\n\u003ctd style=\"width: 294.008px;\"\u003ePVD\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd style=\"width: 248.992px;\"\u003eSubstrate Surface\u003cbr\u003e\n\u003c\/td\u003e\n\u003ctd style=\"width: 294.008px;\"\u003eSingle Side Polished\u003cbr\u003e\n\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd style=\"width: 248.992px;\"\u003eThin Film Material\u003c\/td\u003e\n\u003ctd style=\"width: 294.008px;\"\u003eAluminum-Silicon-Copper (Al-Si-Cu)\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003ctr\u003e\n\u003ctd style=\"width: 248.992px;\"\u003eThin Film Thickness\u003c\/td\u003e\n\u003ctd style=\"width: 294.008px;\"\u003e50 nm - 1500 nm customizable\u003c\/td\u003e\n\u003c\/tr\u003e\n\u003c\/tbody\u003e\n\u003c\/table\u003e\n\u003ch3\u003eReference:\u003c\/h3\u003e\n\u003cp\u003e[1] \u003ca href=\"https:\/\/doi.org\/10.1116\/1.4711040\" rel=\"noopener\" target=\"_blank\"\u003e\u003cspan data-mce-fragment=\"1\"\u003eMasayuki Fujii\u003c\/span\u003e\u003cspan class=\"al-author-delim\" data-mce-fragment=\"1\"\u003e,\u003cspan data-mce-fragment=\"1\"\u003e \u003c\/span\u003e\u003c\/span\u003e\u003cspan data-mce-fragment=\"1\"\u003eTakahiro Namazu\u003c\/span\u003e\u003cspan class=\"al-author-delim\" data-mce-fragment=\"1\"\u003e,\u003cspan data-mce-fragment=\"1\"\u003e \u003c\/span\u003e\u003c\/span\u003e\u003cspan data-mce-fragment=\"1\"\u003eHiroki Fujii\u003c\/span\u003e\u003cspan class=\"al-author-delim\" data-mce-fragment=\"1\"\u003e,\u003cspan data-mce-fragment=\"1\"\u003e \u003c\/span\u003e\u003c\/span\u003e\u003cspan data-mce-fragment=\"1\"\u003eKei Masunishi\u003c\/span\u003e\u003cspan class=\"al-author-delim\" data-mce-fragment=\"1\"\u003e,\u003cspan data-mce-fragment=\"1\"\u003e \u003c\/span\u003e\u003c\/span\u003e\u003cspan data-mce-fragment=\"1\"\u003eYasushi Tomizawa\u003c\/span\u003e\u003cspan class=\"al-author-delim\" data-mce-fragment=\"1\"\u003e,\u003cspan data-mce-fragment=\"1\"\u003e \u003c\/span\u003e\u003c\/span\u003e\u003cspan data-mce-fragment=\"1\"\u003eShozo Inoue; Quasistatic and dynamic mechanical properties of Al–Si–Cu structural films in uniaxial tension. \u003c\/span\u003e\u003cem data-mce-fragment=\"1\"\u003eJ. Vac. Sci. Technol. B\u003c\/em\u003e\u003cspan data-mce-fragment=\"1\"\u003e 1 May 2012; 30 (3): 031804.\u003c\/span\u003e\u003c\/a\u003e\u003cbr\u003e\u003c\/p\u003e\n\u003cp\u003e\u003cspan data-mce-fragment=\"1\"\u003e[2] \u003ca href=\"https:\/\/doi.org\/10.1557\/JMR.1999.0170\" target=\"_blank\" rel=\"noopener\"\u003eWitvrouw A, Proost J, Roussel Ph, Cosemans P, Maex K. Stress Relaxation in Al–Cu and Al–Si–Cu Thin Films. \u003ci data-mce-fragment=\"1\"\u003eJournal of Materials Research\u003c\/i\u003e. 1999;14(4):1246-1254.\u003c\/a\u003e\u003c\/span\u003e\u003c\/p\u003e","brand":"MSE Supplies","offers":[{"title":"50nm","offer_id":40302911553594,"sku":"WA5344","price":296.95,"currency_code":"USD","in_stock":true},{"title":"500nm","offer_id":40302911586362,"sku":"WA5345","price":296.95,"currency_code":"USD","in_stock":true},{"title":"1um","offer_id":40302911619130,"sku":"WA5346","price":296.95,"currency_code":"USD","in_stock":true},{"title":"1.5um","offer_id":40302911651898,"sku":"WA5347","price":296.95,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0722\/7785\/files\/mse-pro-4-inch-aluminum-silicon-copper-al-si-cu-thin-film-on-silicon-wafer-50nm-mse-supplies-llc-wafers-21992075690042.png?v=1752499694","url":"https:\/\/www.msesupplies.com\/en-gb\/products\/mse-pro-4-inch-aluminum-silicon-copper-al-si-cu-thin-film-on-silicon-wafer","provider":"MSE Supplies","version":"1.0","type":"link"}