High Purity Sacrificial Carbon Paste, Fugitive Paste
High Purity Sacrificial LTCC Carbon Paste
Sacrificial "thermally fugitive" carbon tapes and carbon paste are used for fabricating buried cavities, micro-channels, and MEM's structures in Low Temperature Co-fired Ceramic (LTCC) multilayer devices and other laminated components. Such fugitive paste can be burned out cleanly during firing to leave desired cavities.
MSE Supplies LLC is an authorized distributor of these products made by C12 Advanced Technologies.
C12 Advanced Technologies LTCC Carbon Pastes are used to form in-situ micro-channels, buried cavities, and MEMs structures in Low Temperature Co-fired Ceramic (LTCC) multilayer devices and other laminated components. LTCC Carbon Pastes have been extensively tested, and are compatible with all major commercial LTCC tape and screen printable systems. LTCC Carbon Paste is a screen printable paste made of specially formulated, high purity carbon that results in low shrinkage and excellent leveling properties during drying. Thermally fugitive LTCC Carbon Pastes burn out cleanly in air atmospheres, and begin to rapidly sublimate at 600 deg. C, leaving behind well-defined, low distortion features including buried cavities and micro-channels.
HAZMAT shipping and handling cost applies to this product.
Carbon Tapes and Carbon Paste Product Features:
- Forms in-situ, buried channels, cavities, and MEMs structures in LTCC and other multilayer composites.
- Prevents deformation during high pressure lamination of multilayer structures.
- Prevents slumping during firing.
- Contains high purity carbon which burns out cleanly in air atmospheres – sublimates directly without causing stress on green parts.
- Cost effective substitute for removable inserts (e.g. latex, platinum, etc.)
- Does not require complex lamination and firing cycles that are necessary when using other fugitive materials such as wax or polymeric materials.
- Compatible with all major commercial LTCC tape and screen printable systems.
Applications include forming buried channels, cavities and ports in:
- Low Temperature Co-fired Ceramics (LTCC).
- Solid Oxide Fuel Cell (SOFC) membranes.
- Ceramic MEM's.
- Microfluidic devices with channels for gasses and fluids.
- Suspended structures, (accelerometers, pumps, flow sensors, etc.)
- Microreactors and microcombustors.
- Laminated Object Manufacturing (LOM) and rapid prototyping.
- Thermally fugitive masking materials.